Inventor · disambiguated record
Akira Matsunami
Also filed as: MATSUNAMI AKIRA
15 granted patents·10 pending applications·140 citations·filing 1985–2008
93Inventor score
Top patents by PatentIndex Score
25 records- 0187US7125789B2Composite metal column for mounting semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 24, 2006·35 cites·5 claims
- 0279US6812477B2Integrated circuit identificationTEXAS INSTRUMENTS INC·Filed 2002·Granted Nov 2, 2004·24 cites·13 claims
- 0375US7371673B2Method and apparatus for attaching an IC package to a PCB assemblyTEXAS INSTRUMENTS INC·Filed 2005·Granted May 13, 2008·7 cites·13 claims
- 0472US7078821B2Ball film for integrated circuit fabrication and testingTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 18, 2006·12 cites·7 claims
- 0568US7132314B2System and method for forming one or more integrated circuit packages using a flexible leadframe structureTEXAS INSTRUMENTS INC·Filed 2004·Granted Nov 7, 2006·13 cites·8 claims
- 0664US6969641B2Method and system for integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 29, 2005·12 cites·20 claims
- 0763US7439612B2Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connectorTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 21, 2008·2 cites·8 claims
- 0861US7452799B2Ball film for integrated circuit fabrication and testingTEXAS INSTRUMENTS INC·Filed 2006·Granted Nov 18, 2008·1 cites·8 claims
- 0961US7220606B2Integrated circuit identificationTEXAS INSTRUMENTS INC·Filed 2004·Granted May 22, 2007·8 cites·3 claims
- 1058US7550852B2Composite metal column for mounting semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 23, 2009·1 cites·13 claims
- 1156US2009075404A1Ball film for integrated circuit fabrication and testingTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1255US6840751B2Vertical mold die press machineTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 11, 2005·4 cites·3 claims
- 1352US6872593B2Vertical mold die press machineTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 29, 2005·3 cites·2 claims
- 1445US6951980B2Package for an electrical deviceTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 4, 2005·2 cites·8 claims
- 1544US4625493AApparatus for wrapping the end surface of cylindrical objectYUWA SANGYO KK·Filed 1985·Granted Dec 2, 1986·12 cites·3 claims
- 1644US2009085207A1Ball grid array substrate package and solder padTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1743US2008299685A1One piece method for integrated circuit (IC) assemblyTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1842US2008006937A1Solderability Improvement Method for Leaded Semiconductor PackageTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 1942US2008153208A1Semiconductor Package Block Mold and MethodMATSUNAMI AKIRA·Filed 2007·Application pending·0 cites
- 2039US2008290885A1Probe test system and method for testing a semiconductor packageTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 2138US2006022339A1Solder ball opening protrusion for semiconductor assemblyTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2238US2006091516A1Flexible leaded stacked semiconductor packageMATSUNAMI AKIRA·Filed 2004·Application pending·0 cites
- 2337US2005054126A1System and method for marking the surface of a semiconductor packageTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 2437US2005048680A1Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuitTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 2533US4578925AMethod of and apparatus for packaging a wall of a boreNIPPON STEEL CORP·Filed 1985·Granted Apr 1, 1986·4 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →