Inventor · disambiguated record
Akihiro Miyazawa
Also filed as: MIYAZAWA AKIHIRO
5 granted patents·12 citations·filing 2010–2015
72Inventor score
Top patents by PatentIndex Score
5 records- 0182US8641929B2Low-temperature-sinterable bonding material, and bonding method using the bonding materialENDOH KEIICHI·Filed 2011·Granted Feb 4, 2014·9 cites·8 claims
- 0273US10328534B2Bonding material and bonding method using sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Granted Jun 25, 2019·2 cites·15 claims
- 0360US9240256B2Bonding material and bonding method using the sameENDOH KEIICHI·Filed 2010·Granted Jan 19, 2016·1 cites·4 claims
- 0450US10008471B2Bonding material and bonding method using the sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·2 claims
- 0549US10090275B2Bonding method using bonding materialDOWA ELECTRONICS MATERIALS CO LTD·Filed 2015·Granted Oct 2, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →