Inventor · disambiguated record
Akinori Morino
Also filed as: MORINO AKINORI
5 granted patents·8 pending applications·5 citations·filing 2008–2023
67Inventor score
Top patents by PatentIndex Score
13 records- 0172US9321944B2Easily dismantlable adhesive agent composition and easily dismantlable adhesive tapeMATSUMOTO AKIKAZU·Filed 2012·Granted Apr 26, 2016·1 cites·10 claims
- 0270US10301515B2Easily dismantlable adhesive composition and easily dismantlable adhesive tapeMATSUMOTO AKIKAZU·Filed 2012·Granted May 28, 2019·1 cites·12 claims
- 0358US2023312988A1Adhesive sheet, article and method for producing articleDAINIPPON INK & CHEMICALS·Filed 2023·Application pending·0 cites
- 0457US2025050242A1Degassing module and method for degassing liquidDAINIPPON INK & CHEMICALS·Filed 2022·Application pending·0 cites
- 0555US8394888B2Aqueous dispersion type acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive tapeMORINO AKINORI·Filed 2009·Granted Mar 12, 2013·3 cites·17 claims
- 0654US9206340B2Easily dismantlable adhesive composition and easily dismantlable adhesive tapeMATSUMOTO AKIKAZU·Filed 2012·Granted Dec 8, 2015·0 cites·16 claims
- 0753US2025041764A1Degassing module and method for degassing liquidDAINIPPON INK & CHEMICALS·Filed 2022·Application pending·0 cites
- 0852US2011111660A1Double-sided adhesive tapeDAINIPPON INK & CHEMICALS·Filed 2008·Application pending·0 cites
- 0950US10426044B2Thermosetting adhesive sheet, reinforcement-part-equipped flexible printed circuit, method for manufacturing reinforcement-part-equipped flexible printed circuit, and electronic deviceDAINIPPON INK & CHEMICALS·Filed 2016·Granted Sep 24, 2019·0 cites·9 claims
- 1049US2014194572A1Adhesive composition and easily dismantlable adhesive tapeMATSUMOTO AKIKAZU·Filed 2012·Application pending·0 cites
- 1143US2019144723A1Adhesive sheet and articleDAINIPPON INK & CHEMICALS·Filed 2017·Application pending·0 cites
- 1238US2017158916A1Adhesive tape, electronic device, and method for dismantling articleDAINIPPON INK & CHEMICALS·Filed 2015·Application pending·0 cites
- 1329US2018352659A1Thermosetting material used for reinforcing flexible printed circuit board, reinforced flexible printed circuit board, method for producing the reinforced flexible printed circuit board, and electronic deviceDAINIPPON INK & CHEMICALS·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →