Inventor · disambiguated record

Akihiko Nobukuni

Also filed as: NOBUKUNI AKIHIKO

1 granted patent·0 citations·filing 2015–2015

2Inventor score

Technology areasH10W

Files withMITSUBISHI ELECTRIC CORP1

Top patents by PatentIndex Score

1 record

0125US10347725B2Semiconductor device that facilitates a reduction in the occurrences of cracking in a semiconductor layer accompanying thermal stressMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 9, 2019·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →