Inventor · disambiguated record
Akira Ohtsuka
Also filed as: OHTSUKA AKIRA
15 granted patents·1 pending application·361 citations·filing 1982–2002
95Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES8FUJITSU LTD2MITSUBISHI ELECTRIC CORP2TOYO JOZO KK2YAMATAKE HONEYWELL CO LTD2
Top patents by PatentIndex Score
16 records- 0180US5297263AMicroprocessor with pipeline system having exception processing featuresMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Mar 22, 1994·90 cites·43 claims
- 0273US5086333ASubstrate for semiconductor apparatus having a composite materialSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Feb 4, 1992·27 cites·8 claims
- 0372US5750879AStick-slip detection method and apparatusYAMATAKE HONEYWELL CO LTD·Filed 1997·Granted May 12, 1998·43 cites·14 claims
- 0471US4879588AIntegrated circuit packageSUMITOMO ELECTRIC INDUSTRIES·Filed 1988·Granted Nov 7, 1989·45 cites·12 claims
- 0565US5758686AControl valve abnormality detection method and apparatusYAMATAKE HONEYWELL CO LTD·Filed 1997·Granted Jun 2, 1998·27 cites·12 claims
- 0665US4675290AAssaying peptidase enzyme activityTOYO JOZO KK·Filed 1985·Granted Jun 23, 1987·25 cites·14 claims
- 0757US4588836ANovel synthetic substrate and assay method using the sameTOYO JOZO KK·Filed 1983·Granted May 13, 1986·12 cites·7 claims
- 0856US7343401B2Remote maintenance apparatus, terminal connected to the apparatus and computer readable medium for realizing the apparatus and the terminalFUJITSU LTD·Filed 2001·Granted Mar 11, 2008·7 cites·5 claims
- 0955US4480013ASubstrate for use in semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1982·Granted Oct 30, 1984·17 cites·9 claims
- 1049US5525428ASubstrate for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Jun 11, 1996·10 cites·17 claims
- 1148US5606675AData processor for invalidating prefetched instruction or branch history informationMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Feb 25, 1997·20 cites·7 claims
- 1246US5563101ASubstrate for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Oct 8, 1996·9 cites·50 claims
- 1345US5159432ASemiconductor device package having improved sealing at the aluminum nitride substrate/low melting point glass interfaceSUMITOMO ELECTRIC INDUSTRIES·Filed 1992·Granted Oct 27, 1992·20 cites·6 claims
- 1441US5409864ASubstrate for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Apr 25, 1995·7 cites·3 claims
- 1539US2003131111A1Information processing system, information processing apparatus and access distributing methodFUJITSU LTD·Filed 2002·Application pending·0 cites
- 1632US5708959ASubstrate for semiconductor apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted Jan 13, 1998·2 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →