Inventor · disambiguated record
Akif Özkök
Also filed as: OEZKOEK AKIF · ÖZKÖK AKIF
4 granted patents·3 citations·filing 2003–2024
59Inventor score
Top patents by PatentIndex Score
4 records- 0176US12439528B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2024·Granted Oct 7, 2025·0 cites·13 claims
- 0259US12245383B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Mar 4, 2025·0 cites·12 claims
- 0349US7872130B2Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper depositATOTECH DEUTSCHLAND GMBH·Filed 2003·Granted Jan 18, 2011·3 cites·12 claims
- 0441US12063751B2Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit boardATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Aug 13, 2024·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Akif Özkök files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →