Inventor · disambiguated record
Akitsugu Sasaki
Also filed as: SASAKI AKITSUGU
1 granted patent·1 pending application·6 citations·filing 2007–2009
28Inventor score
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2 records- 0155US8436479B2Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the sameSASAKI AKITSUGU·Filed 2009·Granted May 7, 2013·6 cites·12 claims
- 0241US2010112272A1Film for use in manufacturing semiconductor devices, method for producing the film and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →