Inventor · disambiguated record
Akiyoshi Sawai
Also filed as: SAWAI AKIYOSHI
13 granted patents·925 citations·filing 1994–2019
94Inventor score
Files withMITSUBISHI ELECTRIC CORP13
Top patents by PatentIndex Score
13 records- 0195US5814883APackaged semiconductor chipMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 29, 1998·313 cites·7 claims
- 0295US5554887APlastic molded semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Sep 10, 1996·168 cites·15 claims
- 0388US5666008AFlip chip semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 9, 1997·114 cites·18 claims
- 0487US6046071APlastic molded semiconductor package and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 4, 2000·73 cites·2 claims
- 0582US5834340APlastic molded semiconductor package and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 10, 1998·50 cites·1 claims
- 0679US5710062APlastic molded semiconductor package and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 20, 1998·44 cites·6 claims
- 0778US6256875B1Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jul 10, 2001·50 cites·8 claims
- 0878US6177724B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 23, 2001·56 cites·10 claims
- 0966US6005289APackage for semiconductor device laminated printed circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 21, 1999·30 cites·5 claims
- 1064US6457876B1Surface-mountable optical deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 1, 2002·9 cites·14 claims
- 1161US6451622B1Optical deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 17, 2002·7 cites·16 claims
- 1249US11311970B2Shielding gas nozzle for metal forming and laser metal forming apparatusMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 26, 2022·0 cites·20 claims
- 1336US5903048ALead frame for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted May 11, 1999·11 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →