Inventor · disambiguated record
Akito Shimizu
Also filed as: SHIMIZU AKITO
8 granted patents·5 pending applications·23 citations·filing 2013–2022
81Inventor score
Top patents by PatentIndex Score
13 records- 0190US9741641B2Method for manufacturing semiconductor device, and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 22, 2017·8 cites·23 claims
- 0289US9018745B2Method for manufacturing semiconductor device, and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 28, 2015·11 cites·9 claims
- 0367US10347551B2Semiconductor packageTOSHIBA KK·Filed 2017·Granted Jul 9, 2019·1 cites·20 claims
- 0464US9293396B2Method for manufacturing semiconductor device, and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 22, 2016·1 cites·11 claims
- 0557US9368432B2Semiconductor device and manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 14, 2016·2 cites·20 claims
- 0654US2025040283A1Light detection device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 0753US2025006753A1Semiconductor device and imaging apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 0852US2025126905A1Semiconductor device and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 0952US2017309547A1Method for manufacturing semiconductor device, and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 1045US12243884B2Semiconductor device and solid-state imaging sensorSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Mar 4, 2025·0 cites·27 claims
- 1140US10840166B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 17, 2020·0 cites·8 claims
- 1239US11264313B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2019·Granted Mar 1, 2022·0 cites·12 claims
- 1336US2019198482A1Semiconductor deviceTOSHIBA KK·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →