Inventor · disambiguated record
Akihiro Shimomura
Also filed as: SHIMOMURA AKIHIRO
41 granted patents·9 pending applications·435 citations·filing 1986–2024
98Inventor score
Files withFUJI PHOTO FILM CO LTD30RENESAS ELECTRONICS CORP16NEC CORP1NEC ELECTRONICS CORP1SHIMOMURA AKIHIRO1
Top patents by PatentIndex Score
50 records- 0197US4962009AMicrocapsule containing photo-oxidizing agent and leuco dyeFUJI PHOTO FILM CO LTD·Filed 1988·Granted Oct 9, 1990·49 cites·5 claims
- 0289US4840933AHeat sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1987·Granted Jun 20, 1989·45 cites·8 claims
- 0388US6639278B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2002·Granted Oct 28, 2003·59 cites·9 claims
- 0485US4820682AHeat sensitive recording materialsFUJI PHOTO FILM CO LTD·Filed 1987·Granted Apr 11, 1989·32 cites·10 claims
- 0579US7083891B2Multi-color image forming material and multi-color image forming methodFUJI PHOTO FILM CO LTD·Filed 2002·Granted Aug 1, 2006·12 cites·4 claims
- 0679US4929411AHeat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1988·Granted May 29, 1990·21 cites·8 claims
- 0778US6946425B2Multicolor image forming material and method for forming multicolor imageFUJI PHOTO FILM CO LTD·Filed 2004·Granted Sep 20, 2005·9 cites·3 claims
- 0878US4999333AHeat sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1988·Granted Mar 12, 1991·33 cites·9 claims
- 0977US9385230B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 5, 2016·2 cites·10 claims
- 1077US6758932B2Multicolor image forming material and method for forming multicolor imageFUJI PHOTO FILM CO LTD·Filed 2002·Granted Jul 6, 2004·9 cites·14 claims
- 1176US4758547AHeat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1986·Granted Jul 19, 1988·19 cites·9 claims
- 1275US6830863B2Multicolor image-forming material and method for forming multicolor imageFUJI PHOTO FILM CO LTD·Filed 2002·Granted Dec 14, 2004·10 cites·32 claims
- 1374US12211932B2Semiconductor device with improved breakdown voltageRENESAS ELECTRONICS CORP·Filed 2023·Granted Jan 28, 2025·0 cites·4 claims
- 1473US6879336B2Laser thermal transfer recording method and apparatus thereforFUJI PHOTO FILM CO LTD·Filed 2002·Granted Apr 12, 2005·8 cites·13 claims
- 1573US5028580AHeat sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1988·Granted Jul 2, 1991·16 cites·4 claims
- 1673US2025015175A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1771US6579655B1Laser-heat transfer recording method and image-receiving sheetFUJI PHOTO FILM CO LTD·Filed 2002·Granted Jun 17, 2003·7 cites·5 claims
- 1870US11824113B2Manafacturing method for power MOSFET semiconductor device with improved breakdown voltageRENESAS ELECTRONICS CORP·Filed 2022·Granted Nov 21, 2023·0 cites·2 claims
- 1968US9837492B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·1 cites·15 claims
- 2066US9542720B2Terminal device, image display method, and storage mediumSONY MOBILE COMMUNICATIONS INC·Filed 2013·Granted Jan 10, 2017·2 cites·17 claims
- 2166US6811946B2Multicolor image-forming material and multicolor image-forming methodFUJI PHOTO FILM CO LTD·Filed 2002·Granted Nov 2, 2004·4 cites·12 claims
- 2264US6856337B2Multicolor image-forming method and multicolor image-forming materialFUJI PHOTO FILM CO LTD·Filed 2002·Granted Feb 15, 2005·9 cites·29 claims
- 2363US9117903B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Aug 25, 2015·1 cites·13 claims
- 2463US4857501AManufacturing method of a heat sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1987·Granted Aug 15, 1989·19 cites·6 claims
- 2561US6913866B2Multicolor image-forming material and multicolor image-forming methodFUJI PHOTO FILM CO LTD·Filed 2004·Granted Jul 5, 2005·2 cites·4 claims
- 2659US7090959B2Multicolor image forming material and method of multicolor image forming methodFUJI PHOTO FILM CO LTD·Filed 2002·Granted Aug 15, 2006·2 cites·3 claims
- 2759US6790492B2Multi-color image-forming material and multi-color image-forming processFUJI PHOTO FILM CO LTD·Filed 2002·Granted Sep 14, 2004·2 cites·32 claims
- 2859US2021104625A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 2958US12125905B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Oct 22, 2024·0 cites·5 claims
- 3057US6468634B1Heat transfer sheetFUJI PHOTO FILM CO LTD·Filed 1999·Granted Oct 22, 2002·11 cites·13 claims
- 3156US5407777ADiazo-type recording material comprising a 1-phenyl-3-pyrazolidone(phenidone) as an anti-oxidantFUJI PHOTO FILM CO LTD·Filed 1992·Granted Apr 18, 1995·4 cites·11 claims
- 3255US2023411512A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3354US4826807AHeat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1987·Granted May 2, 1989·6 cites·16 claims
- 3453US6720126B2Laser thermal transfer recording methodFUJI PHOTO FILM CO LTD·Filed 2002·Granted Apr 13, 2004·5 cites·11 claims
- 3552US11557648B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·9 claims
- 3652US10170556B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 3752US2022238651A1Semiconductor device and semiconductor packageRENESAS ELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 3851US5629129AHeat sensitive ink sheet and image forming methodFUJI PHOTO FILM CO LTD·Filed 1995·Granted May 13, 1997·9 cites·11 claims
- 3950US12402368B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Granted Aug 26, 2025·0 cites·12 claims
- 4050US2024395878A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4148US4721700AHeat-sensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1986·Granted Jan 26, 1988·5 cites·9 claims
- 4247US5328796ADiazo type recording material utilizing microencapsulated diazo compound, a coupler and a hydroxyphenylsulfone derivativeFUJI PHOTO FILM CO LTD·Filed 1993·Granted Jul 12, 1994·3 cites·13 claims
- 4345US6060763ASemiconductor device and method for producing sameNEC CORP·Filed 1997·Granted May 9, 2000·11 cites·17 claims
- 4444US2023352521A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4543US2006013632A1Multi-color image forming methodSHIMOMURA AKIHIRO·Filed 2002·Application pending·0 cites
- 4641US2005227024A1Image forming method and final medium to be transferredFUJI PHOTO FILM CO LTD·Filed 2005·Application pending·0 cites
- 4740US2019074273A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 4837US5304452AHeat sensitive diazo type recording material utilizing microencapsulated diazo compound and a coupling componentFUJI PHOTO FILM CO LTD·Filed 1992·Granted Apr 19, 1994·1 cites·10 claims
- 4937US4797384AHeat-sensitive recording sheetFUJI PHOTO FILM CO LTD·Filed 1988·Granted Jan 10, 1989·5 cites·8 claims
- 5031US4845071AHeatsensitive recording materialFUJI PHOTO FILM CO LTD·Filed 1988·Granted Jul 4, 1989·2 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →