Inventor · disambiguated record
Akshay N. Singh
Also filed as: SINGH AKSHAY · SINGH AKSHAY N
16 granted patents·29 pending applications·24 citations·filing 2017–2025
89Inventor score
Top patents by PatentIndex Score
45 records- 0192US10529592B2Semiconductor device assembly with pillar arrayMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 7, 2020·7 cites·17 claims
- 0291US10522507B2Semiconductor device assemblies including multiple shingled stacks of semiconductor diesMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 31, 2019·6 cites·9 claims
- 0389US10312219B2Semiconductor device assemblies including multiple shingled stacks of semiconductor diesMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·5 cites·14 claims
- 0484US10153221B1Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·5 cites·28 claims
- 0582US2024282755A1High density pillar interconnect conversion with stack to substrate connectionMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0680US11973062B2High density pillar interconnect conversion with stack to substrate connectionMICRON TECHNOLOGY INC·Filed 2023·Granted Apr 30, 2024·0 cites·17 claims
- 0776US11088114B2High density pillar interconnect conversion with stack to substrate connectionMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·1 cites·15 claims
- 0874US11587912B2High density pillar interconnect conversion with stack to substrate connectionMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 0971US12424590B2Semiconductor device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 1070US2025218990A1Bond pads for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1169US12191162B2Semiconductor device assembly with pillar arrayMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 1268US12255163B2Bond pads for semiconductor die assemblies and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 18, 2025·0 cites·13 claims
- 1368US2025385205A1Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1465US12278202B2Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1565US2025218933A1Dielectric windows for groups of vias through semiconductor substratesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1664US2025226308A1Semiconductor device with backside connection mechanism and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1764US2025140753A1Stacked semiconductor device with semiconductor dies of variable sizeMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1863US11631644B2High density pillar interconnect conversion with stack to substrate connectionMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 18, 2023·0 cites·19 claims
- 1963US2025096202A1Stacked semiconductor deviceMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2063US2025096171A1Methods for bonding wafers of known good dies, and assemblies resulting from such methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2163US2025054898A1Buffer layer for chips on wafer semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2263US2025273609A2Techniques for semiconductor die coupling in stacked memory architecturesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2363US2025079366A1Semiconductor device with layered dielectricMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2462US11094670B2Semiconductor device assemblies including multiple shingled stacks of semiconductor diesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·0 cites·16 claims
- 2562US2024379596A1Conductive pad on a through-silicon viaMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2661US2025391711A1Heterogenous integration of semiconductor structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2761US2024297149A1Stacked semiconductor deviceMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2861US2024421030A1Semiconductor device with enhanced thermal mitigationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2961US2024339433A1Semiconductor device with a through dielectric viaMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3060US10943794B2Semiconductor device assembly with pillar array and test abilityMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 9, 2021·0 cites·8 claims
- 3158US10998271B1High density pillar interconnect conversion with stack to substrate connectionMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·0 cites·20 claims
- 3257US2025364485A1Dicing multi-die memory stacksMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3357US2024282731A1Hybrid bonding for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3456US2025357398A1Self-aligned patterning on package substrateMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3556US2025309121A1Backside power delivery to logic of a memory architectureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3655US2025336772A1Semiconductor devices with nano-vias, such as nano-through-silicon vias landing on middle-of-line or back-end-of-line layersMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3755US2025323125A1Semiconductor device with backside interface mechanism and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3853US2025309215A1Reconstructed semiconductor die evaluation and power deliveryMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3953US2025309216A1Reconstructed semiconductor die evaluation in stacked memory architecturesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4052US10366934B2Face down dual sided chip scale memory packageMICRON TECHNOLOGY INC·Filed 2018·Granted Jul 30, 2019·0 cites·15 claims
- 4152US2025293226A1Logic recon to support smaller logic dies with memory stacks, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4249US2025239574A1Front-to-front bonding in a stacked memory systemMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4348US2025226324A1Die-to-die probe pad connection in a stacked semiconductor deviceMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4445US2025253216A1Semiconductor package design with terminals for connecting to external capacitorTESLA INC·Filed 2025·Application pending·0 cites
- 4540US2022321016A1Multi-port power converters and power conversion systems, and methods for design and operation thereofUNIV MARYLAND·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →