Inventor · disambiguated record
Akira Sugai
Also filed as: SUGAI AKIRA
8 granted patents·45 citations·filing 1999–2011
85Inventor score
Top patents by PatentIndex Score
8 records- 0174US6491508B1Molding die setOKI ELECTRIC IND CO LTD·Filed 2000·Granted Dec 10, 2002·14 cites·20 claims
- 0261US7625768B2Transfer molding apparatus and method for manufacturing semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Dec 1, 2009·1 cites·8 claims
- 0357US8236621B2Mold resin sealing device and molding methodSUGAI AKIRA·Filed 2011·Granted Aug 7, 2012·2 cites·6 claims
- 0457US6267577B1Transfer molding apparatus for manufacturing semiconductor devicesOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jul 31, 2001·16 cites·14 claims
- 0553US6767484B2Transfer molding method for manufacturing semiconductor devicesOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 27, 2004·4 cites·12 claims
- 0651US7253021B2Transfer molding apparatus and method for manufacturing semiconductor devicesOKI ELECTRIC IND CO LTD·Filed 2004·Granted Aug 7, 2007·3 cites·12 claims
- 0751US6995038B2Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 7, 2006·5 cites·10 claims
- 0842US6756690B2Molding die set and semiconductor device fabricated using the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted Jun 29, 2004·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →