Inventor · disambiguated record
Akiko Sugioka
Also filed as: SUGIOKA AKIKO
5 granted patents·7 pending applications·92 citations·filing 1998–2013
77Inventor score
Top patents by PatentIndex Score
12 records- 0189US6270889B1Making and using an ultra-thin copper foilMITSUI MINING & SMELTING CO·Filed 1998·Granted Aug 7, 2001·64 cites·43 claims
- 0267US6074575AThin film electro-luminescence deviceMITSUI MINING & SMELTING CO·Filed 1998·Granted Jun 13, 2000·25 cites·13 claims
- 0365US7430106B2Materials for forming capacitor layer and printed wiring board having embedded capacitor circuit obtained by using the sameMITSUI MINING & SMELTING CO·Filed 2005·Granted Sep 30, 2008·3 cites·7 claims
- 0447US2011005817A1Capacitor-forming material and printed wiring board provided with capacitorMITSUI MINING & SMELTING CO·Filed 2009·Application pending·0 cites
- 0546US2015247037A1Thermoplastic resin composition and molded article thereofASAHI KASEI CHEMICALS CORP·Filed 2013·Application pending·0 cites
- 0644US9180440B2CatalystYAMAGUCHI MICHITAKA·Filed 2012·Granted Nov 10, 2015·0 cites·5 claims
- 0744US2015065637A1Resin composition and molded body thereofASAHI KASEI CHEMICALS CORP·Filed 2013·Application pending·0 cites
- 0841US2008257588A1Capacitor Layer Forming Material, Manufacturing Method Thereof, and Printed Wiring Board with Embedded Capacitor Layer Obtained Using Capacitor Layer Forming MaterialMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 0938US7719818B2Material for forming capacitor layer and method for manufacturing the material for forming capacitor layerMITSUI MINING & SMELTING CO·Filed 2006·Granted May 18, 2010·0 cites·11 claims
- 1038US2008310073A1Method for Forming Oxide Dielectric Layer, and Capacitor Layer Forming Material Provided with Oxide Dielectric Layer Obtained by the Forming MethodMITSUI MINING & SMELTING CO·Filed 2006·Application pending·0 cites
- 1137US2008130196A1Capacitor Layer Forming Material and Printed Wiring Board Having Embedded Capacitor Layer Obtained by using the Capacitor Layer Forming MaterialMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 1236US2005269673A1Pure copper-coated copper foil and method of producing the same, and TAB tape and method of producing the sameMITSUI MINING & SMELTING CO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →