Inventor · disambiguated record
Akira Takaguchi
Also filed as: TAKAGUCHI AKIRA
8 granted patents·2 pending applications·24 citations·filing 2002–2012
81Inventor score
Top patents by PatentIndex Score
10 records- 0183US9511438B2Solder bump forming method and apparatusSENJU METAL INDUSTRY CO·Filed 2012·Granted Dec 6, 2016·8 cites·4 claims
- 0281US8403199B2Localized jet soldering device and partial jet soldering methodSATO ISSAKU·Filed 2010·Granted Mar 26, 2013·6 cites·13 claims
- 0359US2010163600A1Solder bath and method of heating solder contained in the solder bathSENJU METAL INDUSTRY CO·Filed 2009·Application pending·0 cites
- 0456US8302835B2Point flow soldering apparatusSATO ISSAKU·Filed 2009·Granted Nov 6, 2012·1 cites·5 claims
- 0551US8544713B2Apparatus and method of coating fluxSATO ISSAKU·Filed 2009·Granted Oct 1, 2013·0 cites·2 claims
- 0649US2012224837A1Solder bath and method of heating solder contained in the solder bathSATO ISSAKU·Filed 2012·Application pending·0 cites
- 0748US9956633B2Wave soldering tankTAKAGUCHI AKIRA·Filed 2012·Granted May 1, 2018·0 cites·16 claims
- 0844US6799709B2Method and apparatus for local application of solder to preselected conductor areas on a printed circuit boardSENJU METAL INDUSTRY CO·Filed 2002·Granted Oct 5, 2004·4 cites·7 claims
- 0941US6915941B2Method for local application of solder to preselected areas on a printed circuit boardKTT CO LTD·Filed 2002·Granted Jul 12, 2005·5 cites·5 claims
- 1037US8215534B2Wave soldering tankTAKAGUCHI AKIRA·Filed 2004·Granted Jul 10, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →