Inventor · disambiguated record
Akira Takamatsu
Also filed as: TAKAMATSU AKIRA
18 granted patents·5 pending applications·244 citations·filing 1987–2014
95Inventor score
Top patents by PatentIndex Score
23 records- 0193US7208391B2Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating filmsRENESAS TECH CORP·Filed 2005·Granted Apr 24, 2007·19 cites·15 claims
- 0291US7074691B2Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating materialHITACHI ULSI SYSTEMS C O LTD·Filed 2005·Granted Jul 11, 2006·20 cites·12 claims
- 0387US6693008B1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2000·Granted Feb 17, 2004·29 cites·9 claims
- 0483US6559027B2Semiconductor device and process for producing the smeHITACHI LTD·Filed 2001·Granted May 6, 2003·26 cites·7 claims
- 0578US7060589B2Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depthHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jun 13, 2006·4 cites·13 claims
- 0672US6881646B2Semiconductor device and process for producing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Apr 19, 2005·13 cites·21 claims
- 0770US6242323B1Semiconductor device and process for producing the sameHITACHI LTD·Filed 1998·Granted Jun 5, 2001·28 cites·23 claims
- 0869US6717202B2HSG semiconductor capacitor with migration inhibition layerRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·15 cites·25 claims
- 0961US7402473B2Semiconductor device and process for producing the sameRENESAS TECH CORP·Filed 2005·Granted Jul 22, 2008·1 cites·6 claims
- 1060US6057241AMethod of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 1998·Granted May 2, 2000·27 cites·32 claims
- 1158US6524927B1Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 1999·Granted Feb 25, 2003·17 cites·21 claims
- 1257US10006143B2Power supplying member and high-speed plating machine provided with the sameKYB CORP·Filed 2014·Granted Jun 26, 2018·0 cites·6 claims
- 1355US10006137B2Holding device and high-speed plating machine provided with the sameKYB CORP·Filed 2014·Granted Jun 26, 2018·0 cites·14 claims
- 1455US6720234B2Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processingHITACHI LTD·Filed 2003·Granted Apr 13, 2004·5 cites·28 claims
- 1555US4869201AApparatus for coating can barrelsHOKKAI CAN·Filed 1987·Granted Sep 26, 1989·14 cites·7 claims
- 1651US2016108542A1Anode and high-speed plating machine provided with the sameKYB CORP·Filed 2014·Application pending·0 cites
- 1750US6562695B1Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processingHITACHI LTD·Filed 1999·Granted May 13, 2003·12 cites·35 claims
- 1847US5951885AMethod and apparatus for generating welding pressure in a roller seam welding machineELPATRONIC AG·Filed 1997·Granted Sep 14, 1999·14 cites·9 claims
- 1943US2004106292A1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceFiled 2003·Application pending·0 cites
- 2042US7397104B2Semiconductor integrated circuit device and a method of manufacturing the sameELPIDA MEMORY INC·Filed 2004·Granted Jul 8, 2008·0 cites·13 claims
- 2142US2007114631A1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceSATO HIDENORI·Filed 2007·Application pending·0 cites
- 2239US2003119276A1Semiconductor device and process for producing the sameFiled 2002·Application pending·0 cites
- 2335US2003139027A1Semiconductor integrated circuit device and a method of manufacturing the sameFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akira Takamatsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →