Inventor · disambiguated record
Akitoshi Takanashi
Also filed as: TAKANASHI AKITOSHI
3 granted patents·2 citations·filing 2003–2020
49Inventor score
Top patents by PatentIndex Score
3 records- 0157US7217464B2Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing methodMITSUI MINING & SMELTING CO·Filed 2003·Granted May 15, 2007·2 cites·15 claims
- 0241US12004304B2Method for manufacturing printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Jun 4, 2024·0 cites·7 claims
- 0340US12171067B2Method of manufacturing printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Dec 17, 2024·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →