Inventor · disambiguated record
Akihiro Yaguchi
Also filed as: YAGUCHI AKIHIRO
70 granted patents·3 pending applications·2,663 citations·filing 1988–2019
99Inventor score
Files withHITACHI LTD58RENESAS TECH CORP6HITACHI AUTOMOTIVE SYSTEMS LTD3YAGUCHI AKIHIRO2HITACHI CABLE1
Top patents by PatentIndex Score
73 records- 0199US5608265AEncapsulated semiconductor device package having holes for electrically conductive materialHITACHI LTD·Filed 1994·Granted Mar 4, 1997·567 cites·54 claims
- 0298US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0395US8282412B1Flat cable and connection structure between flat cable and printed wiring boardYAGUCHI AKIHIRO·Filed 2011·Granted Oct 9, 2012·49 cites·12 claims
- 0493US5569960AElectronic component, electronic component assembly and electronic component unitHITACHI LTD·Filed 1995·Granted Oct 29, 1996·105 cites·38 claims
- 0591US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 0691US5571428ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1995·Granted Nov 5, 1996·113 cites·3 claims
- 0790US6639315B2Semiconductor device and mounted semiconductor device structureHITACHI LTD·Filed 2001·Granted Oct 28, 2003·42 cites·22 claims
- 0886US6340793B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 22, 2002·37 cites·14 claims
- 0986US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 1085US8878062B2Cable connection structure and cable connection methodTANAKA KOTARO·Filed 2011·Granted Nov 4, 2014·10 cites·13 claims
- 1185US6927489B1Semiconductor device provided with rewiring layerRENESAS TECH CORP·Filed 2000·Granted Aug 9, 2005·40 cites·12 claims
- 1285US5347429APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1993·Granted Sep 13, 1994·86 cites·10 claims
- 1385US5041901ALead frame and semiconductor device using the sameHITACHI LTD·Filed 1990·Granted Aug 20, 1991·82 cites·20 claims
- 1485US4942452ALead frame and semiconductor deviceHITACHI LTD·Filed 1988·Granted Jul 17, 1990·72 cites·23 claims
- 1584US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 1684US5299092APlastic sealed type semiconductor apparatusHITACHI LTD·Filed 1992·Granted Mar 29, 1994·80 cites·15 claims
- 1784US5159434ASemiconductor device having a particular chip pad structureHITACHI LTD·Filed 1991·Granted Oct 27, 1992·68 cites·27 claims
- 1882US6696765B2Multi-chip moduleHITACHI LTD·Filed 2001·Granted Feb 24, 2004·23 cites·7 claims
- 1980US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 2080US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 2180US5539250APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1991·Granted Jul 23, 1996·63 cites·22 claims
- 2279US6512176B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Jan 28, 2003·23 cites·18 claims
- 2379US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 2479US5895965ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 20, 1999·58 cites·3 claims
- 2578US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 2678US5357139APlastic encapsulated semiconductor device and lead frameHITACHI LTD·Filed 1993·Granted Oct 18, 1994·58 cites·10 claims
- 2777US6348741B1Semiconductor apparatus and a manufacturing method thereofHITACHI LTD·Filed 2000·Granted Feb 19, 2002·25 cites·22 claims
- 2877US5229643ASemiconductor apparatus and semiconductor packageHITACHI LTD·Filed 1991·Granted Jul 20, 1993·54 cites·26 claims
- 2976US5437915ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1994·Granted Aug 1, 1995·47 cites·4 claims
- 3076US5047837ASemiconductor device with heat transfer capHITACHI LTD·Filed 1989·Granted Sep 10, 1991·46 cites·4 claims
- 3174US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 3272US6452256B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Sep 17, 2002·18 cites·19 claims
- 3369US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 3469US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 3569US5293068ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Mar 8, 1994·35 cites·12 claims
- 3668US4987474ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1990·Granted Jan 22, 1991·41 cites·60 claims
- 3767US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 3867US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 3965US11231307B2Physical-quantity detection deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2019·Granted Jan 25, 2022·0 cites·13 claims
- 4064US5296737ASemiconductor device with a plurality of face to face chipsHITACHI LTD·Filed 1991·Granted Mar 22, 1994·34 cites·20 claims
- 4163US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 4263US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 4362US6777816B2Multi-chip moduleHITACHI LTD·Filed 2003·Granted Aug 17, 2004·7 cites·6 claims
- 4462US6049128ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 11, 2000·21 cites·10 claims
- 4561US6130112ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Oct 10, 2000·20 cites·7 claims
- 4661US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 4761US5637914ALead frame and semiconductor device encapsulated by resinHITACHI LTD·Filed 1995·Granted Jun 10, 1997·24 cites·38 claims
- 4860US7038322B2Multi-chip moduleHITACHI LTD·Filed 2004·Granted May 2, 2006·6 cites·9 claims
- 4958USRE37690ELead frame and semiconductor deviceHITACHI LTD·Filed 1995·Granted May 7, 2002·25 cites·48 claims
- 5057US5101263ASemiconductor device and method for manufacturing the sameHITACHI LTD·Filed 1990·Granted Mar 31, 1992·27 cites·8 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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