Inventor · disambiguated record
Akitoshi Yoshii
Also filed as: YOSHII AKITOSHI
34 granted patents·5 pending applications·310 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
39 records- 0194US8853115B2Dielectric ceramic composition and electronic deviceTDK CORP·Filed 2013·Granted Oct 7, 2014·12 cites·9 claims
- 0292US9042079B2Ceramic electronic componentTDK CORP·Filed 2013·Granted May 26, 2015·12 cites·21 claims
- 0391US7304831B2Ceramic electronic component and multilayer capacitorTDK CORP·Filed 2006·Granted Dec 4, 2007·23 cites·10 claims
- 0489US8921248B2Dielectric ceramic composition and electronic deviceTDK CORP·Filed 2013·Granted Dec 30, 2014·7 cites·4 claims
- 0588US6958899B2Electronic deviceTDK CORP·Filed 2004·Granted Oct 25, 2005·45 cites·21 claims
- 0688US6704189B2Electronic device with external terminals and method of production of the sameTDK CORP·Filed 2003·Granted Mar 9, 2004·48 cites·11 claims
- 0786US7735713B2Method for mounting chip component and circuit boardTDK CORP·Filed 2006·Granted Jun 15, 2010·16 cites·4 claims
- 0885US9105405B2Ceramic electronic component with metal terminalsTDK CORP·Filed 2013·Granted Aug 11, 2015·5 cites·12 claims
- 0981US6940708B2Electronic componentTDK CORP·Filed 2004·Granted Sep 6, 2005·30 cites·19 claims
- 1080US7584853B2Electronic component seriesTDK CORP·Filed 2005·Granted Sep 8, 2009·12 cites·6 claims
- 1179US7177138B2Chip-type electronic componentTDK CORP·Filed 2005·Granted Feb 13, 2007·12 cites·6 claims
- 1278US12249467B2Electronic componentTDK CORP·Filed 2024·Granted Mar 11, 2025·0 cites·7 claims
- 1377US9305708B2Multilayer ceramic electronic deviceTDK CORP·Filed 2014·Granted Apr 5, 2016·4 cites·5 claims
- 1476US7498082B2Dielectric ceramic composition having specific dispersion of diffusion depth, electronic device, and multilayer ceramic capacitorTDK CORP·Filed 2006·Granted Mar 3, 2009·9 cites·13 claims
- 1575US9640321B2Ceramic electronic component with metal terminalTDK CORP·Filed 2014·Granted May 2, 2017·2 cites·23 claims
- 1675US8179225B2Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic componentsIGUCHI TOSHIHIRO·Filed 2009·Granted May 15, 2012·9 cites·8 claims
- 1772US7518849B2Multilayer electronic device and the production methodTDK CORP·Filed 2007·Granted Apr 14, 2009·6 cites·20 claims
- 1872US6400553B2Multi-layer ceramic electronic device and method for producing sameTDK CORP·Filed 2001·Granted Jun 4, 2002·20 cites·9 claims
- 1970US8841224B2Dielectric ceramic composition and electronic deviceTDK CORP·Filed 2013·Granted Sep 23, 2014·1 cites·4 claims
- 2070US8674234B2Multilayer ceramic capacitor mounting structure and multilayer ceramic capacitorYOSHII AKITOSHI·Filed 2010·Granted Mar 18, 2014·4 cites·3 claims
- 2169US7751176B2Ceramic electronic componentTDK CORP·Filed 2008·Granted Jul 6, 2010·5 cites·2 claims
- 2269US7339781B2Electronic component and electronic deviceTDK CORP·Filed 2006·Granted Mar 4, 2008·7 cites·2 claims
- 2368US12249464B2Electronic componentTDK CORP·Filed 2021·Granted Mar 11, 2025·0 cites·22 claims
- 2465US7585802B2Method of producing a dielectric ceramic compositionTDK CORP·Filed 2008·Granted Sep 8, 2009·1 cites·4 claims
- 2563US12437927B2Electronic device with a ceramic element and surface-mount terminalsTDK CORP·Filed 2023·Granted Oct 7, 2025·0 cites·8 claims
- 2660US12476048B2Electronic component including accommodation part having openingTDK CORP·Filed 2023·Granted Nov 18, 2025·0 cites·10 claims
- 2760US6956731B2Laminate type electronic componentTDK CORP·Filed 2003·Granted Oct 18, 2005·12 cites·12 claims
- 2859US12412702B2Electronic device having ceramic element and metal terminalsTDK CORP·Filed 2023·Granted Sep 9, 2025·0 cites·14 claims
- 2959US7799409B2Ceramic green sheet structure and method for manufacturing laminated ceramic electronic componentTDK CORP·Filed 2008·Granted Sep 21, 2010·3 cites·2 claims
- 3058US12278055B2Electronic componentTDK CORP·Filed 2023·Granted Apr 15, 2025·0 cites·12 claims
- 3153US12417880B2Electronic device having first and second metal terminalsTDK CORP·Filed 2022·Granted Sep 16, 2025·0 cites·10 claims
- 3252US2007155613A1Dielectric ceramic composition, electronic device, and multilayer ceramic capacitorTDK CORP·Filed 2006·Application pending·0 cites
- 3351US12293874B2Electronic componentTDK CORP·Filed 2022·Granted May 6, 2025·0 cites·35 claims
- 3450US6839218B2Ceramic electronic component having lead wiresTDK CORP·Filed 2002·Granted Jan 4, 2005·5 cites·14 claims
- 3548US10943739B2Electronic componentTDK CORP·Filed 2019·Granted Mar 9, 2021·0 cites·9 claims
- 3645US2007142209A1Dielectric ceramic composition, electronic device, and multilayer ceramic capacitorTDK CORP·Filed 2006·Application pending·0 cites
- 3743US2009211687A1Method for manufacturing multilayer electronic componentTDK CORP·Filed 2009·Application pending·0 cites
- 3842US2007223177A1Multilayer electronic device and the production methodTDK CORP·Filed 2007·Application pending·0 cites
- 3942US2007227642A1Method of making multilayer electronic componentTDK CORP·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akitoshi Yoshii files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →