Inventor · disambiguated record
Akira Yoshizumi
Also filed as: YOSHIZUMI AKIRA
19 granted patents·1 pending application·797 citations·filing 1979–2003
96Inventor score
Top patents by PatentIndex Score
20 records- 0198US5641997APlastic-encapsulated semiconductor deviceTOSHIBA KK·Filed 1994·Granted Jun 24, 1997·442 cites·20 claims
- 0279US5907382ATransparent conductive substrate and display apparatusTOSHIBA KK·Filed 1995·Granted May 25, 1999·61 cites·28 claims
- 0374US5336736APolysilane and polysilane compositionTOSHIBA KK·Filed 1993·Granted Aug 9, 1994·20 cites·15 claims
- 0472US4248920AResin-sealed semiconductor deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1979·Granted Feb 3, 1981·29 cites·17 claims
- 0570US5325583AMethod for manufacturing printed circuit boardTOSHIBA KK·Filed 1992·Granted Jul 5, 1994·32 cites·34 claims
- 0667US4719255AEpoxy resin composition for encapsulation of semi-conductor deviceTOSHIBA KK·Filed 1985·Granted Jan 12, 1988·22 cites·13 claims
- 0764US5272377AMaleimide resin composition and resin encapsulated semiconductor device manufactured using the compositionTOSHIBA KK·Filed 1991·Granted Dec 21, 1993·34 cites·12 claims
- 0864US4921537AShrinkage compensated mortar materialSANDOZ LTD·Filed 1984·Granted May 1, 1990·19 cites·3 claims
- 0963US4916174ARubber-modified phenolic resin composition and method of manufacturing the sameTOSHIBA KK·Filed 1988·Granted Apr 10, 1990·17 cites·8 claims
- 1062US5043211AEpoxy resin composition and a resin-sealed semiconductor deviceTOSHIBA KK·Filed 1988·Granted Aug 27, 1991·26 cites·8 claims
- 1161US5216077ARubber-modified phenolic resin composition and method of manufacturing the sameTOSHIBA KK·Filed 1992·Granted Jun 1, 1993·17 cites·4 claims
- 1260US5258426ASemiconductor device encapsulantTOSHIBA KK·Filed 1990·Granted Nov 2, 1993·29 cites·18 claims
- 1347US5362559APolysilane monomolecular film and polysilane built-up filmTOSHIBA KK·Filed 1993·Granted Nov 8, 1994·10 cites·38 claims
- 1445US6645643B2Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefromST MICROELECTRONICS SRL·Filed 2001·Granted Nov 11, 2003·7 cites·35 claims
- 1545US5438113AThermosetting resin compositionTOSHIBA KK·Filed 1993·Granted Aug 1, 1995·6 cites·10 claims
- 1642US5747557AMethod of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardenerTOSHIBA KK·Filed 1996·Granted May 5, 1998·15 cites·11 claims
- 1742US2005239959A1Concrete surfacing methodHISASHI OSAMU·Filed 2003·Application pending·0 cites
- 1839US5853952AColor developing organic material, color developing resin composition and colored thin film patternTOSHIBA KK·Filed 1996·Granted Dec 29, 1998·7 cites·5 claims
- 1937US5637667AThermosetting resin compositionTOSHIBA KK·Filed 1995·Granted Jun 10, 1997·4 cites·11 claims
- 2029US5252639AMolding resin composition and molded electronic componentTOSHIBA KK·Filed 1991·Granted Oct 12, 1993·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →