Inventor · disambiguated record
Alan P. Boone
Also filed as: BOONE ALAN P
23 granted patents·2 pending applications·329 citations·filing 2005–2021
96Inventor score
Files withROCKWELL COLLINS INC9LOWER NATHAN P8BAE SYS INF & ELECT SYS INTEG2BOONE ALAN P2HAMILTON BRANDON C2
Top patents by PatentIndex Score
25 records- 0198US8664047B2Integrated circuit tampering protection and reverse engineering prevention coatings and methodsLOWER NATHAN P·Filed 2011·Granted Mar 4, 2014·71 cites·20 claims
- 0297US8084855B2Integrated circuit tampering protection and reverse engineering prevention coatings and methodsLOWER NATHAN P·Filed 2007·Granted Dec 27, 2011·79 cites·23 claims
- 0392US7830021B1Tamper resistant packaging with transient liquid phase bondingROCKWELL COLLINS INC·Filed 2005·Granted Nov 9, 2010·29 cites·10 claims
- 0490US9196555B1Integrated circuit protection and ruggedization coatings and methodsLOWER NATHAN P·Filed 2011·Granted Nov 24, 2015·10 cites·21 claims
- 0589US8076185B1Integrated circuit protection and ruggedization coatings and methodsLOWER NATHAN P·Filed 2006·Granted Dec 13, 2011·17 cites·34 claims
- 0688US9545043B1Shielding encapsulation for electrical circuitryHAMILTON BRANDON C·Filed 2010·Granted Jan 10, 2017·18 cites·17 claims
- 0788US7675151B1Silicon-based packaging for electronic devicesROCKWELL COLLINS INC·Filed 2005·Granted Mar 9, 2010·18 cites·41 claims
- 0887US8119040B2Glass thick film embedded passive materialLOWER NATHAN P·Filed 2008·Granted Feb 21, 2012·13 cites·18 claims
- 0987US7638866B1Stacked packaging designs offering inherent anti-tamper protectionROCKWELL COLLINS INC·Filed 2005·Granted Dec 29, 2009·17 cites·37 claims
- 1085US8581108B1Method for providing near-hermetically coated integrated circuit assembliesBOONE ALAN P·Filed 2007·Granted Nov 12, 2013·13 cites·18 claims
- 1183US8637980B1Adhesive applications using alkali silicate glass for electronicsLOWER NATHAN P·Filed 2007·Granted Jan 28, 2014·11 cites·23 claims
- 1279US8617913B2Alkali silicate glass based coating and method for applyingLOWER NATHAN P·Filed 2008·Granted Dec 31, 2013·7 cites·10 claims
- 1377US11474576B1Electrical device with thermally controlled performanceROCKWELL COLLINS INC·Filed 2019·Granted Oct 18, 2022·3 cites·19 claims
- 1474US9565758B2Alkali silicate glass based coating and method for applyingROCKWELL COLLINS INC·Filed 2013·Granted Feb 7, 2017·2 cites·9 claims
- 1573US8166645B2Method for providing near-hermetically coated, thermally protected integrated circuit assembliesWILCOXON ROSS K·Filed 2007·Granted May 1, 2012·6 cites·12 claims
- 1670US9589913B1Flip chip stacking utilizing interposerROCKWELL COLLINS INC·Filed 2013·Granted Mar 7, 2017·4 cites·14 claims
- 1767US10727203B1Die-in-die-cavity packagingROCKWELL COLLINS INC·Filed 2018·Granted Jul 28, 2020·1 cites·18 claims
- 1866US8461698B1PCB external ground plane via conductive coatingHAMILTON BRANDON C·Filed 2010·Granted Jun 11, 2013·3 cites·6 claims
- 1964US11233030B1Microfluidic manufactured mesoscopic microelectronics interconnectROCKWELL COLLINS INC·Filed 2017·Granted Jan 25, 2022·1 cites·20 claims
- 2062US8640619B1Use of polyamide thermal plastics as low cost electronics potting compounds for munitions applicationsDIMKE MARK T·Filed 2011·Granted Feb 4, 2014·6 cites·13 claims
- 2155US8585937B2Glass thick film embedded passive materialLOWER NATHAN P·Filed 2012·Granted Nov 19, 2013·0 cites·11 claims
- 2252US8935848B1Method for providing near-hermetically coated integrated circuit assembliesBOONE ALAN P·Filed 2013·Granted Jan 20, 2015·0 cites·20 claims
- 2343US2023163041A1Selective heat sinkBAE SYS INF & ELECT SYS INTEG·Filed 2021·Application pending·0 cites
- 2443US2023163040A1Die level cavity heat sinkBAE SYS INF & ELECT SYS INTEG·Filed 2021·Application pending·0 cites
- 2538US7635919B1Low modulus stress buffer coating in microelectronic devicesROCKWELL COLLINS INC·Filed 2005·Granted Dec 22, 2009·0 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when Alan P. Boone files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →