Inventor · disambiguated record
Alex Chan
Also filed as: CHAN ALEX · CHAN ALEX B
3 granted patents·1 pending application·30 citations·filing 1995–2019
70Inventor score
Top patents by PatentIndex Score
4 records- 0188US10653010B1Connection of multilayer printed conductive ink through filled microviasFLEX LTD·Filed 2019·Granted May 12, 2020·5 cites·15 claims
- 0246US2021076496A1Solder electronic components to printed conductive inkFLEX LTD·Filed 2019·Application pending·0 cites
- 0343US5713563AWire bonding to flexible substratesHEWLETT PACKARD CO·Filed 1995·Granted Feb 3, 1998·14 cites·4 claims
- 0440US6484393B1Method for wire bonding to flexible substratesAGILENT TECHNOLOGIES INC·Filed 1997·Granted Nov 26, 2002·11 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →