Inventor · disambiguated record
Alex Chew
Also filed as: CHEW ALEX
3 granted patents·3 pending applications·102 citations·filing 2002–2005
76Inventor score
Technology areasH10W
Files withADVANPACK SOLUTIONS PTE LTD6
Top patents by PatentIndex Score
6 records- 0193US7456496B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2005·Granted Nov 25, 2008·48 cites·16 claims
- 0278US6929981B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 16, 2005·26 cites·10 claims
- 0377US6734039B2Semiconductor chip grid array package design and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·28 cites·19 claims
- 0435US2005087883A1Flip chip package using no-flow underfill and method of fabricationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Application pending·0 cites
- 0534US2004108580A1Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 0634US2004084508A1Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assemblyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →