Inventor · disambiguated record
Alfred Grant Elliot
Also filed as: ELLIOT ALFRED GRANT
21 granted patents·3 pending applications·31 citations·filing 2012–2024
92Inventor score
Files withWATLOW ELECTRIC MFG11COMPONENT RE ENG COMPANY INC6COMPONENT RE ENGINEERING COMPANY INC5COMPONENT RE ENGINEERING COMPNAY INC1ELLIOT ALFRED GRANT1
Top patents by PatentIndex Score
24 records- 0190US12397379B2Nickel-carbon and nickel-cobalt-carbon brazes and brazing processes for joining ceramics and metals and semiconductor processing and industrial equipment using sameWATLOW ELECTRIC MFG·Filed 2024·Granted Aug 26, 2025·0 cites·17 claims
- 0289US11712745B2Semiconductor substrate support with multiple electrodes and method for making sameWATLOW ELECTRIC MFG·Filed 2022·Granted Aug 1, 2023·1 cites·14 claims
- 0387US8684256B2Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 1, 2014·7 cites·10 claims
- 0486US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 0586US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 0682US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesWATLOW ELECTRIC MFG·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 0782US2023321766A1Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using SameWATLOW ELECTRIC MFG·Filed 2023·Application pending·0 cites
- 0878US12128494B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2023·Granted Oct 29, 2024·0 cites·13 claims
- 0978US2025050439A1Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 1077US8932690B2Plate and shaft deviceELLIOT ALFRED GRANT·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 1175US11331738B2High temperature resistant silicon joint for the joining of ceramicsWATLOW ELECTRIC MFG·Filed 2019·Granted May 17, 2022·0 cites·20 claims
- 1274US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 1373US11666993B2Nickel-carbon and nickel-cobalt-carbon brazes and brazing processes for joining ceramics and metals and semiconductor processing and industrial equipment using sameWATLOW ELECTRIC MFG·Filed 2019·Granted Jun 6, 2023·0 cites·14 claims
- 1470US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 1569US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 1669US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 1767US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 1861US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 1960US11648620B2Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameWATLOW ELECTRIC MFG·Filed 2018·Granted May 16, 2023·0 cites·13 claims
- 2057US11823890B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2157US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 2255US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 2354US11495450B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 8, 2022·0 cites·16 claims
- 2443US2014014710A1Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized RegionsCOMPONENT RE ENGINEERING COMPNAY INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →