Inventor · disambiguated record
Alexander Fluegel
Also filed as: FLUEGEL ALEXANDER
14 granted patents·11 pending applications·12 citations·filing 2011–2023
84Inventor score
Top patents by PatentIndex Score
25 records- 0189US9758885B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2013·Granted Sep 12, 2017·6 cites·16 claims
- 0281US12054842B2Composition for tin-silver alloy electroplating comprising a complexing agentBASF SE·Filed 2019·Granted Aug 6, 2024·1 cites·19 claims
- 0375US9631292B2Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect featuresROEGER-GOEPFERT CORNELIA·Filed 2012·Granted Apr 25, 2017·4 cites·20 claims
- 0471US2022298664A1Composition for Cobalt Electroplating Comprising Leveling AgentBASF SE·Filed 2022·Application pending·0 cites
- 0566US11926918B2Composition for metal plating comprising suppressing agent for void free filingBASF SE·Filed 2017·Granted Mar 12, 2024·1 cites·17 claims
- 0666US11377748B2Composition for cobalt electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 5, 2022·0 cites·12 claims
- 0763US11840771B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2021·Granted Dec 12, 2023·0 cites·15 claims
- 0861US2025388725A1Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodepositionBASF SE·Filed 2023·Application pending·0 cites
- 0958US2021040635A1Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2020·Application pending·0 cites
- 1055US11535946B2Composition for tin or tin alloy electroplating comprising leveling agentBASF SE·Filed 2018·Granted Dec 27, 2022·0 cites·14 claims
- 1155US2025051949A1Alkaline composition for copper electroplating comprising a grain refinerBASF SE·Filed 2022·Application pending·0 cites
- 1253US11459665B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2018·Granted Oct 4, 2022·0 cites·19 claims
- 1353US11242606B2Composition for tin or tin alloy electroplating comprising suppressing agentBASF SE·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 1450US12509790B2Composition for tin or tin alloy electroplating comprising leveling agentBASF SE·Filed 2021·Granted Dec 30, 2025·0 cites·19 claims
- 1550US12098473B2Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2019·Granted Sep 24, 2024·0 cites·19 claims
- 1650US2023203694A1Alkaline composition for copper electroplating comprising a grain refinerBASF SE·Filed 2021·Application pending·0 cites
- 1749US2022356592A1Composition for copper bump electrodeposition comprising a leveling agentBASF SE·Filed 2020·Application pending·0 cites
- 1848US9683302B2Composition for metal electroplating comprising leveling agentSIEMER MICHAEL·Filed 2011·Granted Jun 20, 2017·0 cites·19 claims
- 1948US2019226107A1Composition for cobalt plating comprising additive for void-free submicron feature fillingBASF SE·Filed 2017·Application pending·0 cites
- 2047US2025051950A1Alkaline composition for copper electroplating comprising a defect reduction agentBASF SE·Filed 2022·Application pending·0 cites
- 2146US2025129503A1Composition for copper electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2022·Application pending·0 cites
- 2245US12134834B2Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agentBASF SE·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 2343US2023203695A1Alkaline Composition For Copper Electroplating Comprising A Defect Reduction AgentBASF SE·Filed 2021·Application pending·0 cites
- 2441US2023265576A1Composition For Copper Electroplating On A Cobalt SeedBASF SE·Filed 2021·Application pending·0 cites
- 2539US11387108B2Composition for metal electroplating comprising leveling agentBASF SE·Filed 2018·Granted Jul 12, 2022·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →