Inventor · disambiguated record
Albert Lin
Also filed as: LIN ALBERT · LIN ALBERT M
7 granted patents·3 pending applications·241 citations·filing 1983–2025
88Inventor score
Files withAPACK TECHNOLOGIES INC2AMERICAN TELEPHONE & TELEGRAPH1ARTHREX INC1AT & T BELL LAB1CALIFORNIA INST OF TECHN1
Top patents by PatentIndex Score
10 records- 0189US8371079B2Reinforced mull post assemblyPLASTPRO 2000 INC·Filed 2011·Granted Feb 12, 2013·21 cites·21 claims
- 0283US6048775AMethod to make shallow trench isolation structure by HDP-CVD and chemical mechanical polish processesVANGUARD INT SEMICONDUCT CORP·Filed 1999·Granted Apr 11, 2000·101 cites·9 claims
- 0375US4676847AControlled boron doping of siliconAMERICAN TELEPHONE & TELEGRAPH·Filed 1986·Granted Jun 30, 1987·48 cites·8 claims
- 0473US4604150AControlled boron doping of siliconAT & T BELL LAB·Filed 1985·Granted Aug 5, 1986·45 cites·11 claims
- 0549US2005152955A1Electrostatically self-assembled antimicrobial coating for medical applicationsFiled 2004·Application pending·0 cites
- 0648US2025331885A1Punch ObturatorARTHREX INC·Filed 2025·Application pending·0 cites
- 0741US4581222AMembrane immune assayCALIFORNIA INST OF TECHN·Filed 1983·Granted Apr 8, 1986·7 cites·20 claims
- 0841US2009032826A1Multi-chip light emitting diode packageLUSTROUS TECHNOLOGY LTD·Filed 2008·Application pending·0 cites
- 0938US6221689B1Method for improving the reliability of underfill process for a chipAPACK TECHNOLOGIES INC·Filed 1997·Granted Apr 24, 2001·10 cites·9 claims
- 1034US6258622B1Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging methodAPACK TECHNOLOGIES INC·Filed 1999·Granted Jul 10, 2001·9 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →