Inventor · disambiguated record
Alexander Lostetter
Also filed as: LOSTETTER ALEXANDER B · Lostetter Alexander
26 granted patents·221 citations·filing 2007–2024
96Inventor score
Files withCREE FAYETTEVILLE INC10MITCHELL DAVID J7WOLFSPEED INC6ARKANSAS POWER ELECTRONICS INT INC1LOSTETTER ALEXANDER B1
Top patents by PatentIndex Score
26 records- 0196US11696417B2High power multilayer module having low inductance and fast switching for paralleling power devicesWOLFSPEED INC·Filed 2022·Granted Jul 4, 2023·4 cites·19 claims
- 0295US10917992B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2019·Granted Feb 9, 2021·14 cites·30 claims
- 0395US10749443B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2019·Granted Aug 18, 2020·10 cites·27 claims
- 0493US9407251B1Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integrationARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Aug 2, 2016·29 cites·4 claims
- 0592US8023269B2Wireless telemetry electronic circuit board for high temperature environmentsSIEMENS ENERGY INC·Filed 2008·Granted Sep 20, 2011·20 cites·1 claims
- 0690US10212838B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2017·Granted Feb 19, 2019·6 cites·20 claims
- 0790US8519866B2Wireless telemetry for instrumented componentMITCHELL DAVID J·Filed 2007·Granted Aug 27, 2013·21 cites·19 claims
- 0889US8092080B2Wireless telemetry circuit structure for measuring temperature in high temperature environmentsMITCHELL DAVID J·Filed 2008·Granted Jan 10, 2012·17 cites·21 claims
- 0988US8223036B2Wireless telemetry electronic circuitry for measuring strain in high-temperature environmentsMITCHELL DAVID J·Filed 2008·Granted Jul 17, 2012·14 cites·17 claims
- 1086US8629783B2Wireless telemetry electronic circuitry for measuring strain in high-temperature environmentsMITCHELL DAVID J·Filed 2012·Granted Jan 14, 2014·9 cites·20 claims
- 1184US10784235B2Silicon carbide power moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Sep 22, 2020·4 cites·18 claims
- 1284US9728868B1Apparatus having self healing liquid phase power connects and method thereofCREE FAYETTEVILLE INC·Filed 2014·Granted Aug 8, 2017·7 cites·18 claims
- 1383US12446180B2High power multilayer module having low inductance and fast switching for paralleling power devicesWOLFSPEED INC·Filed 2024·Granted Oct 14, 2025·0 cites·23 claims
- 1483US11445630B2High power multilayer module having low inductance and fast switching for paralleling power devicesWOLFSPEED INC·Filed 2021·Granted Sep 13, 2022·1 cites·20 claims
- 1583USD903590SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Dec 1, 2020·15 cites·1 claims
- 1683US8458899B2Method for manufacturing a circuit for high temperature and high g-force environmentsMITCHELL DAVID J·Filed 2011·Granted Jun 11, 2013·5 cites·6 claims
- 1782US8220990B2Wireless telemetry electronic circuit package for high temperature environmentsMITCHELL DAVID J·Filed 2008·Granted Jul 17, 2012·9 cites·20 claims
- 1881USD954668SHousing for a power module assemblyWOLFSPEED INC·Filed 2019·Granted Jun 14, 2022·19 cites·1 claims
- 1980USD969740SPower moduleCREE FAYETTEVILLE INC·Filed 2020·Granted Nov 15, 2022·5 cites·1 claims
- 2080US8525036B2Wireless telemetry electronic circuit board for high temperature environmentsMITCHELL DAVID J·Filed 2011·Granted Sep 3, 2013·4 cites·7 claims
- 2170USD1036395SPower moduleWOLFSPEED INC·Filed 2022·Granted Jul 23, 2024·2 cites·1 claims
- 2267US12010823B2High power multilayer module having low inductance and fast switching for paralleling power devicesCREE FAYETTEVILLE INC·Filed 2020·Granted Jun 11, 2024·0 cites·35 claims
- 2364US8410600B2Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting filmLOSTETTER ALEXANDER B·Filed 2010·Granted Apr 2, 2013·3 cites·16 claims
- 2456USD909310SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Feb 2, 2021·0 cites·1 claims
- 2552USD1081603SPower moduleWOLFSPEED INC·Filed 2024·Granted Jul 1, 2025·0 cites·1 claims
- 2645USD954667SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Jun 14, 2022·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →