Inventor · disambiguated record
Allen Mcteer
Also filed as: MCTEER ALLEN
81 granted patents·11 pending applications·1,370 citations·filing 1996–2025
99Inventor score
Top patents by PatentIndex Score
92 records- 0198US6800504B2Integrated circuit device and fabrication using metal-doped chalcogenide materialsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 5, 2004·251 cites·22 claims
- 0297US6455424B1Selective cap layers over recessed polysilicon plugsMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 24, 2002·124 cites·40 claims
- 0396US6730547B2Integrated circuit device and fabrication using metal-doped chalcogenide materialsMICRON TECHNOLOGY INC·Filed 2002·Granted May 4, 2004·60 cites·7 claims
- 0496US6709958B2Integrated circuit device and fabrication using metal-doped chalcogenide materialsMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 23, 2004·61 cites·26 claims
- 0595US9419212B2Barrier film techniques and configurations for phase-change memory elementsINTEL CORP·Filed 2014·Granted Aug 16, 2016·20 cites·20 claims
- 0695US8981334B1Memory cells having regions containing one or both of carbon and boronMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 17, 2015·10 cites·12 claims
- 0795US5939788ACopper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with cooperMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 17, 1999·156 cites·61 claims
- 0893US9093367B2Methods of forming doped regions in semiconductor substratesMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 28, 2015·11 cites·7 claims
- 0993US7737010B2Method of photoresist strip for plasma doping process of semiconductor manufacturingMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 15, 2010·22 cites·15 claims
- 1092US7592212B2Methods for determining a dose of an impurity implanted in a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 22, 2009·19 cites·22 claims
- 1191US7749849B2Methods of selectively oxidizing semiconductor structures, and structures resulting therefromMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 6, 2010·16 cites·28 claims
- 1290US7830016B2Seed layer for reduced resistance tungsten filmINTEL CORP·Filed 2008·Granted Nov 9, 2010·21 cites·14 claims
- 1390US7723713B2Layered resistance variable memory device and method of fabricationMICRON TECHNOLOGY INC·Filed 2006·Granted May 25, 2010·14 cites·7 claims
- 1489US6890790B2Co-sputter deposition of metal-doped chalcogenidesMICRON TECHNOLOGY INC·Filed 2002·Granted May 10, 2005·26 cites·6 claims
- 1587US11107823B2Integrated structures and methods of forming integrated structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 31, 2021·2 cites·24 claims
- 1687US7446393B2Co-sputter deposition of metal-doped chalcogenidesMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 4, 2008·5 cites·5 claims
- 1786US6373137B1Copper interconnect for an integrated circuit and methods for its fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 16, 2002·30 cites·50 claims
- 1885US8263958B2Layered resistance variable memory device and method of fabricationCAMPBELL KRISTY A·Filed 2010·Granted Sep 11, 2012·6 cites·18 claims
- 1984US7061111B2Interconnect structure for use in an integrated circuitMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 13, 2006·29 cites·45 claims
- 2084US6204179B1Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with copperMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 20, 2001·61 cites·14 claims
- 2183US7476556B2Systems and methods for plasma processing of microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 13, 2009·5 cites·25 claims
- 2283US5700718AMethod for increased metal interconnect reliability in situ formation of titanium aluminideMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 23, 1997·52 cites·17 claims
- 2382US9786475B2Systems and methods for plasma processing of microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 10, 2017·1 cites·9 claims
- 2482US8642135B2Systems and methods for plasma doping microfeature workpiecesQIN SHU·Filed 2005·Granted Feb 4, 2014·7 cites·23 claims
- 2582US6348403B1Suppression of hillock formation in thin aluminum filmsMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 19, 2002·24 cites·16 claims
- 2682US5838052AReducing reflectivity on a semiconductor wafer by annealing titanium and aluminumMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 17, 1998·46 cites·8 claims
- 2781US7087919B2Layered resistance variable memory device and method of fabricationMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·28 cites·58 claims
- 2879US10504911B2Integrated structures and methods of forming integrated structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 10, 2019·1 cites·7 claims
- 2977US10325917B2Integrated structures and methods of forming integrated structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 18, 2019·1 cites·8 claims
- 3077US2025261367A1Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory CellsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3176US6642623B2Multi-layered copper bond pad for an integrated circuitMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 4, 2003·16 cites·14 claims
- 3274US7679193B2Use of AIN as cooper passivation layer and thermal conductorMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·4 cites·11 claims
- 3374US6841478B2Method of forming a multi-layered copper bond pad for an integrated circuitMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·14 cites·9 claims
- 3474US6825135B2Elimination of dendrite formation during metal/chalcogenide glass depositionMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 30, 2004·9 cites·13 claims
- 3573US7138290B2Methods of depositing silver onto a metal selenide-comprising surface and methods of depositing silver onto a selenium-comprising surfaceMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 21, 2006·8 cites·46 claims
- 3673US6258466B1Metallization on titanium aluminideMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 10, 2001·12 cites·30 claims
- 3772US9780103B2Methods of forming integrated structuresMICRON TECHNOLOGY INC·Filed 2015·Granted Oct 3, 2017·1 cites·20 claims
- 3872US9385317B2Memory cells and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 5, 2016·1 cites·10 claims
- 3971US6858465B2Elimination of dendrite formation during metal/chalcogenide glass depositionMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 22, 2005·7 cites·17 claims
- 4071US6110830AMethods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing methods of forming aluminum-comprising linesMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 29, 2000·33 cites·16 claims
- 4170US8821697B2Silver selenide sputtered films and method and apparatus for controlling defect formation in silver selenide sputtered filmsMICRON TECHNOLOGY INC·Filed 2012·Granted Sep 2, 2014·0 cites·15 claims
- 4270US8227875B2Semiconductor structures resulting from selective oxidationHU YONGJUN JEFF·Filed 2010·Granted Jul 24, 2012·2 cites·18 claims
- 4369US8216935B2Methods of forming transistor gate constructions, methods of forming NAND transistor gate constructions, and methods forming DRAM transistor gate constructionsBLOMILEY ERIC R·Filed 2009·Granted Jul 10, 2012·5 cites·30 claims
- 4468US8497194B2Methods of forming doped regions in semiconductor substratesMICRON TECHNOLOGY INC·Filed 2012·Granted Jul 30, 2013·1 cites·8 claims
- 4568US7964436B2Co-sputter deposition of metal-doped chalcogenidesROUND ROCK RES LLC·Filed 2008·Granted Jun 21, 2011·0 cites·10 claims
- 4668US7632702B2Methods of forming a resistance variable elementMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 15, 2009·0 cites·22 claims
- 4768US6261947B1Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 17, 2001·30 cites·30 claims
- 4867US12295140B2Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted May 6, 2025·0 cites·14 claims
- 4967US8975603B2Systems and methods for plasma doping microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 10, 2015·1 cites·18 claims
- 5066US8797662B2Apparatuses and devices for absorbing electromagnetic radiation, and methods of forming the apparatuses and devicesHU YONGJUN JEFF·Filed 2010·Granted Aug 5, 2014·1 cites·35 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →