Inventor · disambiguated record
Alvin Seah
Also filed as: SEAH ALVIN
2 granted patents·6 citations·filing 2006–2011
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0165US7880277B2Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assemblyINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 1, 2011·4 cites·9 claims
- 0256US8263438B2Method for connecting a die assembly to a substrate in an integrated circuitSEAH ALVIN·Filed 2011·Granted Sep 11, 2012·2 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →