Inventor · disambiguated record
Alexander C. Tain
Also filed as: TAIN ALEXANDER · TAIN ALEXANDER C
10 granted patents·193 citations·filing 1995–2020
90Inventor score
Top patents by PatentIndex Score
10 records- 0184US6732266B1Method and apparatus for reconfiguring circuit board and integrated circuit packet arrangement with one-time programmable elementsADVANCED MICRO DEVICES INC·Filed 2000·Granted May 4, 2004·37 cites·20 claims
- 0273US6449170B1Integrated circuit package incorporating camouflaged programmable elementsADVANCED MICRO DEVICES INC·Filed 2000·Granted Sep 10, 2002·32 cites·18 claims
- 0372US6417563B1Spring frame for protecting packaged electronic devicesADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 9, 2002·19 cites·25 claims
- 0464US5608638ADevice and method for automation of a build sheet to manufacture a packaged integrated circuitADVANCED MICRO DEVICES INC·Filed 1995·Granted Mar 4, 1997·42 cites·35 claims
- 0558US6319752B1Single-layer autorouterADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 20, 2001·12 cites·8 claims
- 0658US6229219B1Flip chip package compatible with multiple die footprints and method of assembling the sameADVANCED MICRO DEVICES INC·Filed 2000·Granted May 8, 2001·9 cites·1 claims
- 0754US6569694B1Method of checking BGA substrate designADVANCED MICRO DEVICES INC·Filed 2001·Granted May 27, 2003·8 cites·9 claims
- 0850US6581189B1Computer implemented method and program for automating flip-chip bump layout in integrated circuit package designADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 17, 2003·25 cites·31 claims
- 0948US11227834B2Package grounding systemSEAGATE TECHNOLOGY LLC·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 1035US6041269AIntegrated circuit package verificationADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 21, 2000·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →