Inventor · disambiguated record
Alberto F. Viscarra
Also filed as: VISCARRA ALBERTO F
12 granted patents·42 citations·filing 2008–2020
88Inventor score
Top patents by PatentIndex Score
12 records- 0182US9780458B2Methods and apparatus for antenna having dual polarized radiating elements with enhanced heat dissipationRAYTHEON CO·Filed 2015·Granted Oct 3, 2017·5 cites·16 claims
- 0277US8043464B2Systems and methods for assembling lightweight RF antenna structuresRAYTHEON CO·Filed 2009·Granted Oct 25, 2011·10 cites·24 claims
- 0376US8453314B2Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacleVISCARRA ALBERTO F·Filed 2012·Granted Jun 4, 2013·4 cites·4 claims
- 0474US8920091B2Fastener with bilateral seal for liquid immersion cooling applicationsHEINRICH ETHAN S·Filed 2008·Granted Dec 30, 2014·11 cites·13 claims
- 0573US11195779B2Electronic module for motherboardRAYTHEON CO·Filed 2020·Granted Dec 7, 2021·1 cites·18 claims
- 0671US9660333B2Radiator, solderless interconnect thereof and grounding element thereofRAYTHEON CO·Filed 2014·Granted May 23, 2017·3 cites·13 claims
- 0765US8127432B2Process for fabricating an origami formed antenna radiating structureVISCARRA ALBERTO F·Filed 2009·Granted Mar 6, 2012·3 cites·13 claims
- 0864US8354595B2Adhesive reinforced open hole interconnectRAYTHEON CO·Filed 2010·Granted Jan 15, 2013·2 cites·8 claims
- 0954US8547280B2Systems and methods for exciting long slot radiators of an RF antennaYANG FANGCHOU·Filed 2010·Granted Oct 1, 2013·2 cites·17 claims
- 1053US8362856B2RF transition with 3-dimensional molded RF structureRAYTHEON CO·Filed 2009·Granted Jan 29, 2013·1 cites·31 claims
- 1149US10333212B2Radiator, solderless interconnect thereof and grounding element thereofRAYTHEON CO·Filed 2017·Granted Jun 25, 2019·0 cites·20 claims
- 1243US9072164B2Process for fabricating a three dimensional molded feed structureVISCARRA ALBERTO F·Filed 2009·Granted Jun 30, 2015·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →