Inventor · disambiguated record
Aleksander Zubelewicz
Also filed as: ZUBELEWICZ ALEKSANDER
11 granted patents·1 pending application·247 citations·filing 1994–2015
92Inventor score
Top patents by PatentIndex Score
12 records- 0179US6224711B1Assembly process for flip chip package having a low stress chip and resulting structureIBM·Filed 1998·Granted May 1, 2001·56 cites·2 claims
- 0274US6488806B2Assembly process for flip chip package having a low stress chip and resulting structureIBM·Filed 2001·Granted Dec 3, 2002·20 cites·12 claims
- 0371US5567884ACircuit board assembly torsion tester and methodIBM·Filed 1994·Granted Oct 22, 1996·50 cites·40 claims
- 0461US6492724B2Structure for reinforcing a semiconductor device to prevent crackingIBM·Filed 2001·Granted Dec 10, 2002·8 cites·12 claims
- 0561US5789682ACircuit board assembly torsion tester and methodIBM·Filed 1997·Granted Aug 4, 1998·25 cites·12 claims
- 0660US5838568AHeated circuit assembly tester and methodIBM·Filed 1996·Granted Nov 17, 1998·21 cites·23 claims
- 0759US5736646ACircuit board assembly torsion tester and methodIBM·Filed 1996·Granted Apr 7, 1998·22 cites·14 claims
- 0855US6347901B1Solder interconnect techniquesIBM·Filed 1999·Granted Feb 19, 2002·20 cites·2 claims
- 0953US5949682AHeated circuit assembly tester and methodIBM·Filed 1998·Granted Sep 7, 1999·15 cites·5 claims
- 1046US2008029888A1Solder Interconnect Joints For A Semiconductor PackageIBM·Filed 2006·Application pending·0 cites
- 1145US6197619B1Method for reinforcing a semiconductor device to prevent crackingIBM·Filed 1999·Granted Mar 6, 2001·10 cites·31 claims
- 1239US10302814B2Mechanisms-based fracture model for geomaterialsHOEINK TOBIAS·Filed 2015·Granted May 28, 2019·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Aleksander Zubelewicz files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →