Inventor · disambiguated record
Amy Rae Griffin
Also filed as: GRIFFIN AMY · GRIFFIN AMY R · GRIFFIN AMY RAE
9 granted patents·21 pending applications·12 citations·filing 2001–2025
79Inventor score
Top patents by PatentIndex Score
30 records- 0185US11116297B1Modular tablescape carrying caseSOCIAL STUDIES 101 LLC·Filed 2020·Granted Sep 14, 2021·11 cites·19 claims
- 0272US2024109560A1Dual-mode cruise controlMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0371US2025182839A1Memory with parallel main and test interfacesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0470US12078672B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 0569US12437832B2Repair techniques for coupled memory diesMICRON TECHNOLOGY INC·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0668US11011452B2Heat spreaders for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted May 18, 2021·1 cites·23 claims
- 0765US2025246511A1Methods and apparatus for integrating carbon nanofiber into semiconductor devices using w2w fusion bondingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0864US12243610B2Memory with parallel main and test interfacesMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 4, 2025·0 cites·12 claims
- 0963US11904895B2Dual-mode cruise controlMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 20, 2024·0 cites·17 claims
- 1063US2023343672A1Methods and apparatus for integrating carbon nanofiber into semiconductor devices using w2w fusion bondingMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1162US2025233044A1Memory device with enhanced thermal conductivityMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1261US2024421030A1Semiconductor device with enhanced thermal mitigationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1361US2024313098A1Transistor architectures in coupled semiconductor systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1460US11372043B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 28, 2022·0 cites·17 claims
- 1560US2024237363A1Techniques for modular die configurations for multi-channel memoryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1659US11385281B2Heat spreaders for use in semiconductor device testing, such as burn-in testingMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 12, 2022·0 cites·15 claims
- 1759US2021225733A1Heat spreaders for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 1859US2024186274A1Techniques for thermal distribution in coupled semiconductor systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1957US2025234452A1Module-level thermal management mechanismMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2057US2025157885A1Memory module with extended conductive plane for heat dissipationMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2156US12459532B2Sunlight processing for autonomous vehicle controlMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 4, 2025·0 cites·16 claims
- 2256US2025309121A1Backside power delivery to logic of a memory architectureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2355US2024176523A1Techniques for coupled host and memory diesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2453US2025323118A1Thermal vias for semiconductor componentsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2553US2021386167A1Modular tablescape carrying caseSOCIAL STUDIES 101 LLC·Filed 2021·Application pending·0 cites
- 2651US2025279153A2Sparing techniques in stacked memory architecturesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2751US2024355371A1Data path signal amplification in coupled semiconductor systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2851US2024079369A1Connecting semiconductor dies through tracesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2945US2021272872A1Thermal management materials for semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 3034US2003002967A1Lift and align tableFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →