Inventor · disambiguated record
Amendra Koul
Also filed as: KOUL AMENDRA
18 granted patents·7 pending applications·5 citations·filing 2018–2024
89Inventor score
Files withCISCO TECH INC25
Top patents by PatentIndex Score
25 records- 0182US10674598B1Measuring effective dielectric constant using via-stub resonanceCISCO TECH INC·Filed 2019·Granted Jun 2, 2020·3 cites·20 claims
- 0280US11202368B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2020·Granted Dec 14, 2021·1 cites·19 claims
- 0378US12289831B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 0478US12160948B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 0574US10684123B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2018·Granted Jun 16, 2020·1 cites·10 claims
- 0673US11781858B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0773US11761755B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2021·Granted Sep 19, 2023·0 cites·19 claims
- 0873US11751322B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 0972US11706870B2Providing one or more carbon layers to a copper conductive material to reduce power loss in a power planeCISCO TECH INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 1068US12003282B2Channel predictive behavior and fault analysisCISCO TECH INC·Filed 2023·Granted Jun 4, 2024·0 cites·20 claims
- 1168US11330702B2Integrating graphene into the skin depth region of high speed communications signals for a printed circuit boardCISCO TECH INC·Filed 2020·Granted May 10, 2022·0 cites·17 claims
- 1268US11293752B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2020·Granted Apr 5, 2022·0 cites·20 claims
- 1368US11287245B2Fiber weave skew assessment for printed circuit boardsCISCO TECH INC·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 1465US11777239B2Twinaxial cable port structure coupled to an integrated circuit socketCISCO TECH INC·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 1562US11606152B2Channel predictive behavior and fault analysisCISCO TECH INC·Filed 2021·Granted Mar 14, 2023·0 cites·17 claims
- 1658US2025275055A1Novel high-speed via impedance matching methodology using low dielectric constant backdrill filling materialCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1755US11425821B2Optimizing design and performance for printed circuit boardsCISCO TECH INC·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 1855US2024345180A1System and method for determining cable performance based on frequency dependent skewCISCO TECH INC·Filed 2024·Application pending·0 cites
- 1955US2025029931A1Package assembly for integrated circuitCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2054US2025261301A1Managing crosstalk for high data rate interfacesCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2153US10735039B1Removal of channel impairments due to skew and channel asymmetry with a composite filterCISCO TECH INC·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 2253US2025212319A1Balancing loss across all ports on printed circuit board tracesCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2353US2025140447A1Coupled conductors in twinax cable and stripline printed circuit board for skew mitigationCISCO TECH INC·Filed 2024·Application pending·0 cites
- 2452US2023378677A1High speed and high density cable interconnectsCISCO TECH INC·Filed 2023·Application pending·0 cites
- 2550US11894296B2Integrated circuit package with heatsinkCISCO TECH INC·Filed 2021·Granted Feb 6, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →