Inventor · disambiguated record
Amanda E. Schuckman
Also filed as: SCHUCKMAN AMANDA E
21 granted patents·4 pending applications·77 citations·filing 2013–2024
93Inventor score
Top patents by PatentIndex Score
25 records- 0197US9147663B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2013·Granted Sep 29, 2015·34 cites·6 claims
- 0295US11694960B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 0393US9917044B2Package with bi-layered dielectric structureINTEL CORP·Filed 2015·Granted Mar 13, 2018·12 cites·25 claims
- 0493US9640485B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2015·Granted May 2, 2017·8 cites·16 claims
- 0591US11133257B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2019·Granted Sep 28, 2021·4 cites·16 claims
- 0690US9837341B1Tin-zinc microbump structuresINTEL CORP·Filed 2016·Granted Dec 5, 2017·6 cites·17 claims
- 0789US2025015004A1Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0885US10297563B2Copper seed layer and nickel-tin microbump structuresINTEL CORP·Filed 2016·Granted May 21, 2019·4 cites·11 claims
- 0984US10685850B2High density organic interconnect structuresINTEL CORP·Filed 2016·Granted Jun 16, 2020·3 cites·11 claims
- 1084US9953959B1Metal protected fan-out cavityINTEL CORP·Filed 2017·Granted Apr 24, 2018·4 cites·8 claims
- 1183US12132002B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1280US12062551B2High density organic interconnect structuresINTEL CORP·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1375US11631595B2High density organic interconnect structuresINTEL CORP·Filed 2021·Granted Apr 18, 2023·0 cites·11 claims
- 1471US11195727B2High density organic interconnect structuresINTEL CORP·Filed 2020·Granted Dec 7, 2021·0 cites·18 claims
- 1564US10475745B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2018·Granted Nov 12, 2019·0 cites·7 claims
- 1661US10103103B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2017·Granted Oct 16, 2018·0 cites·15 claims
- 1755US10373900B2Tin-zinc microbump structures and method of making sameINTEL CORP·Filed 2017·Granted Aug 6, 2019·0 cites·8 claims
- 1853US2019244922A1Nickel-tin microbump structures and method of making sameINTEL CORP·Filed 2019·Application pending·0 cites
- 1945US10856424B2Electronic assembly that includes void free holesINTEL CORP·Filed 2015·Granted Dec 1, 2020·0 cites·8 claims
- 2042US10916486B2Semiconductor device including silane based adhesion promoter and method of makingINTEL CORP·Filed 2016·Granted Feb 9, 2021·0 cites·14 claims
- 2142US9741606B2Desmear with metalized protective filmINTEL CORP·Filed 2015·Granted Aug 22, 2017·0 cites·18 claims
- 2240US10553453B2Systems and methods for semiconductor packages using photoimageable layersINTEL CORP·Filed 2016·Granted Feb 4, 2020·0 cites·20 claims
- 2339US8877632B1Providing a void-free filled interconnect structure in a layer of package substrateSCHUCKMAN AMANDA E·Filed 2013·Granted Nov 4, 2014·0 cites·21 claims
- 2434US2017174894A1Stress tolerant composite material and architectureCHAVALI SRI CHAITRA·Filed 2015·Application pending·0 cites
- 2530US2018323138A1Redundant through-hole interconnect structuresINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →