Inventor · disambiguated record
Amlan Sen
Also filed as: SEN AMLAN
12 granted patents·3 pending applications·4 citations·filing 2009–2024
81Inventor score
Top patents by PatentIndex Score
15 records- 0184US11107716B1Automation line for processing a molded panelPYXIS CF PTE LTD·Filed 2020·Granted Aug 31, 2021·2 cites·19 claims
- 0275US11456259B2Panel level packaging for devicesPYXIS CF PTE LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 0370US12270119B2Plating apparatus and operation method thereofPYXIS CF PTE LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 0466US11261535B2Plating apparatus and operation method thereofPYXIS CF PTE LTD·Filed 2019·Granted Mar 1, 2022·1 cites·20 claims
- 0562US2025096017A1Apparatus and method for bonding a plurality of dies to a carrier panelPYXIS CF PTE LTD·Filed 2024·Application pending·0 cites
- 0647US9120169B2Method for device packagingCHEW HWEE SENG·Filed 2009·Granted Sep 1, 2015·0 cites·17 claims
- 0746US11817326B2Precision reconstruction for panel-level packagingPYXIS CF PTE LTD·Filed 2021·Granted Nov 14, 2023·0 cites·19 claims
- 0844US12183620B2Apparatus and method for bonding a plurality of dies to a carrier panelPYXIS CF PTE LTD·Filed 2021·Granted Dec 31, 2024·0 cites·15 claims
- 0943US11518070B2Compression molding machine and method of compression moldingPYXIS CF PTE LTD·Filed 2020·Granted Dec 6, 2022·0 cites·17 claims
- 1041US11552043B2Post bond inspection of devices for panel packagingPYXIS CF PTE LTD·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1141US2015348895A1Substrate for semiconductor packaging and method of forming samePBT PTE LTD·Filed 2014·Application pending·0 cites
- 1240US11990445B2Apparatus and method for semiconductor device bondingPYXIS CF PTE LTD·Filed 2019·Granted May 21, 2024·0 cites·12 claims
- 1339US11810797B2Wetting processing apparatus and operation method thereofPYXIS CF PTE LTD·Filed 2019·Granted Nov 7, 2023·0 cites·17 claims
- 1432US9082775B2System for encapsulation of semiconductor diesSEN AMLAN·Filed 2009·Granted Jul 14, 2015·0 cites·13 claims
- 1531US2014154037A1Method and systems for semiconductor chip pick & transfer and bondingSEN AMLAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →