Inventor · disambiguated record
Ampere A. Tseng
Also filed as: TSENG AMPERE · TSENG AMPERE A
9 granted patents·3 pending applications·593 citations·filing 1998–2005
92Inventor score
Top patents by PatentIndex Score
12 records- 0195US6030199AApparatus for freeform fabrication of a three-dimensional objectUNIV ARIZONA STATE·Filed 1998·Granted Feb 29, 2000·205 cites·21 claims
- 0290US6372178B1Method for freeform fabrication of a three-dimensional objectUNIV ARIZONA STATE·Filed 1999·Granted Apr 16, 2002·92 cites·11 claims
- 0389US6980716B1Coherent evanescent wave imagingUNIV ARIZONA·Filed 2002·Granted Dec 27, 2005·45 cites·65 claims
- 0489US6251340B1Adaptable filament deposition system and method for freeform fabrication of three-dimensional objectsUNIV ARIZONA·Filed 2000·Granted Jun 26, 2001·29 cites·6 claims
- 0588US6149072ADroplet selection systems and methods for freeform fabrication of three-dimensional objectsUNIV ARIZONA·Filed 1998·Granted Nov 21, 2000·85 cites·19 claims
- 0687US6309711B1Method for manufacturing a three-dimensional objectUNIV ARIZONA·Filed 2000·Granted Oct 30, 2001·35 cites·7 claims
- 0781US6216765B1Apparatus and method for manufacturing a three-dimensional objectUNIV ARIZONA·Filed 1998·Granted Apr 17, 2001·47 cites·7 claims
- 0880US6113696AAdaptable filament deposition system and method for freeform fabrication of three-dimensional objectsUNIV ARIZONA·Filed 1998·Granted Sep 5, 2000·36 cites·6 claims
- 0960US6851587B1Crucible and spindle for a variable size drop deposition systemUNIV ARIZONA·Filed 1999·Granted Feb 8, 2005·19 cites·5 claims
- 1049US2005145363A1Crucible and spindle for a variable size drop deposition systemFiled 2005·Application pending·0 cites
- 1140US2003165079A1Swirling-flow micro mixer and methodFiled 2002·Application pending·0 cites
- 1240US2003071269A1Apparatus and method for laser selective bonding technique for making sealed or enclosed microchannel structuresFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →