Inventor · disambiguated record
Amir Wagiman
Also filed as: WAGIMAN AMIR · WAGIMAN AMIR N R · WAGIMAN AMIR NUR RASHID
2 granted patents·2 pending applications·20 citations·filing 1999–2014
55Inventor score
Top patents by PatentIndex Score
4 records- 0155US6413849B1Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication thereforINTEL CORP·Filed 1999·Granted Jul 2, 2002·20 cites·16 claims
- 0239US9070787B2Package-on-package assembly and methodINTEL CORP·Filed 2014·Granted Jun 30, 2015·0 cites·13 claims
- 0330US2010078788A1Package-on-package assembly and methodWAGIMAN AMIR·Filed 2008·Application pending·0 cites
- 0427US2007151753A1Printed circuit board having plated through hole with multiple connections and method of fabricating sameTHOR SOO F·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →