Inventor · disambiguated record
Andrew M. Bayless
Also filed as: BAYLESS ANDREW M
36 granted patents·18 pending applications·34 citations·filing 2010–2025
95Inventor score
Top patents by PatentIndex Score
54 records- 0196US11515171B2Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 29, 2022·4 cites·37 claims
- 0291US11715696B2Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 1, 2023·3 cites·12 claims
- 0388US10325926B2Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 18, 2019·5 cites·20 claims
- 0487US2025364250A1Microelectronic devices and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0584US11195740B2Methods and apparatus for wafer handling and processingMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 7, 2021·3 cites·20 claims
- 0684US10403598B2Methods and system for processing semiconductor device structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·3 cites·21 claims
- 0782US10163693B1Methods for processing semiconductor dice and fabricating assemblies incorporating sameMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·3 cites·20 claims
- 0881US12406847B2Microelectronic devices and related methods of fabricating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 2, 2025·0 cites·17 claims
- 0981US10861765B2Carrier removal by use of multilayer foilMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 8, 2020·2 cites·20 claims
- 1080US12100661B2Semiconductor die edge protection for semiconductor device assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 24, 2024·0 cites·14 claims
- 1180US11289360B2Methods and apparatus for protection of dielectric films during microelectronic component processingMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 29, 2022·2 cites·24 claims
- 1279US2025015000A1Semiconductor die edge protection for semiconductor device assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1378US9716023B2Methods for temporarily bonding a device wafer to a carrier wafer, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Jul 25, 2017·4 cites·18 claims
- 1476US12512368B2Thin die release for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1575US12087697B2Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1675US2024429172A1Semiconductor devices with recessed pads for die stack interconnectionsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1773US10679967B2Systems enabling lower-stress processing of semiconductor device structures and related structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 9, 2020·1 cites·20 claims
- 1873US10326044B2Method and apparatus for processing semiconductor device structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 18, 2019·1 cites·17 claims
- 1971US11961818B2Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 16, 2024·0 cites·19 claims
- 2071US11776908B2Semiconductor die edge protection for semiconductor device assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 3, 2023·0 cites·14 claims
- 2171US10971471B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 6, 2021·2 cites·20 claims
- 2270US11784050B2Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatusMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 10, 2023·0 cites·28 claims
- 2370US2024006223A1Method for semiconductor die edge protection and semiconductor die separationMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2466US11239129B2Package cooling by coil cavityMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 1, 2022·0 cites·19 claims
- 2565US11410961B2Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·26 claims
- 2664US11764096B2Method for semiconductor die edge protection and semiconductor die separationMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 19, 2023·0 cites·13 claims
- 2763US2025132279A1Non-conductive film fillet control in semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2861US11676955B2Separation method and assembly for chip-on-wafer processingMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 13, 2023·0 cites·14 claims
- 2961US9608119B2Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structuresTANG SANH D·Filed 2010·Granted Mar 28, 2017·1 cites·14 claims
- 3060US11791212B2Thin die release for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 17, 2023·0 cites·6 claims
- 3160US10749071B2Apparatus for processing device structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 18, 2020·0 cites·16 claims
- 3260US2025046730A1Apparatus with implanted alignment mark and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3359US12506118B2Perpendicular semiconductor device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 3459US2025346028A1Corrosion-susceptible bonding layer in assisting semiconductor wafer debondingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3559US2025349591A1Facilitating wafer debonding by introducing moisture to bonding interfaceMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3658US10763186B2Package cooling by coil cavityMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 1, 2020·0 cites·31 claims
- 3758US2024153910A1Ferromagnetic control of wafer bondingMICRON TECHNOLGY INC·Filed 2023·Application pending·0 cites
- 3858US2024222184A1Semiconductor substrate with a sacrificial annulusMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 3957US10559495B2Methods for processing semiconductor dice and fabricating assemblies incorporating sameMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 11, 2020·0 cites·14 claims
- 4057US2025046731A1Apparatus with thinning-based alignment mark and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4156US10431519B1Carrier removal by use of multilayer foilMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·0 cites·17 claims
- 4256US2023317511A1Semiconductor assemblies with system and method for smoothing surfaces of 3d structuresMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 4355US2025316494A1Techniques for surface modifications during bonding proceduresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4454US11189609B2Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 4554US2024055366A1Spacer for chips on wafer semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4653US11189590B2Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 30, 2021·0 cites·20 claims
- 4753US2024038707A1Semiconductor device assembly interconnection pillars and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 4852US11784092B2Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processingMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 10, 2023·0 cites·9 claims
- 4951US11646269B2Recessed semiconductor devices, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted May 9, 2023·0 cites·22 claims
- 5050US2025329676A1Microelectronic devices, and related methods and memory devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Andrew M. Bayless files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →