Inventor · disambiguated record
Anis Fauzi Bin Abdul Aziz
Also filed as: BIN ABDUL AZIZ ANIS FAUZI
22 granted patents·4 pending applications·39 citations·filing 2013–2024
93Inventor score
Top patents by PatentIndex Score
26 records- 0194US9741643B2Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columnsTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 22, 2017·9 cites·7 claims
- 0291US11791170B2Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0390US9515009B2Packaged semiconductor device having leadframe features preventing delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 6, 2016·7 cites·6 claims
- 0487US9324640B1Triple stack semiconductor packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 26, 2016·8 cites·7 claims
- 0586US11264310B2Spring bar leadframe, method and packaged electronic device with zero draft angleTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 1, 2022·2 cites·16 claims
- 0683US9691748B2Forming a panel of triple stack semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 27, 2017·4 cites·10 claims
- 0781US10115660B2Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columnsTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 30, 2018·2 cites·13 claims
- 0878US11056462B2Locking dual leadframe for flip chip on leadframe packagesTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 6, 2021·2 cites·20 claims
- 0976US10784190B2Method of making leadframe stripTEXAS INSTRUMENTS INC·Filed 2017·Granted Sep 22, 2020·1 cites·19 claims
- 1071US11373940B2Method of making leadframe stripTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 28, 2022·0 cites·16 claims
- 1170US11742263B2Flippable leadframe for packaged electronic system having vertically stacked chip and componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 29, 2023·0 cites·21 claims
- 1269US9892936B2Packaged semiconductor device having leadframe features preventing delaminationTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 13, 2018·1 cites·5 claims
- 1367US9496206B2Flippable leadframe for packaged electronic system having vertically stacked chips and componentsTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 15, 2016·1 cites·6 claims
- 1463US12087674B2Spring bar leadframe, method and packaged electronic device with zero draft angleTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 1561US2025372576A1Semiconductor device package with stub leads and methodsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1660US2025308939A1Leadframe and electronic device singulation processBIN ABDUL AZIZ ANIS FAUZI·Filed 2024·Application pending·0 cites
- 1759US11830791B2Leads for leadframe and semiconductor packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 28, 2023·0 cites·28 claims
- 1856US10879154B2Flippable leadframe for packaged electronic system having vertically stacked chips and componentsTEXAS INSTRUMENTS INC·Filed 2016·Granted Dec 29, 2020·0 cites·11 claims
- 1955US10541225B2Methods of assembling a flip chip on a locking dual leadframeTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 21, 2020·0 cites·16 claims
- 2052US2021043466A1Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 2151US11626350B2Cutting a leadframe assembly with a plurality of punching toolsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 11, 2023·0 cites·9 claims
- 2251US11569154B2Interdigitated outward and inward bent leads for packaged electronic deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2351US2015060123A1Locking dual leadframe for flip chip on leadframe packagesTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 2448US9275983B2Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 1, 2016·0 cites·9 claims
- 2546US9842807B2Integrated circuit assemblyTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 12, 2017·0 cites·20 claims
- 2644US11569152B2Electronic device with lead pitch gapTEXAS INSTRUMENTS INC·Filed 2019·Granted Jan 31, 2023·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →