Inventor · disambiguated record
Andrew Clarke
Also filed as: CLARKE ANDREW · CLARKE ANDREW P · CLARKE ANDREW PETER
40 granted patents·14 pending applications·518 citations·filing 1991–2024
98Inventor score
Files withEASTMAN KODAK CO12RAYTHEON CO11CLARKE ANDREW10SPUTTERED FILMS INC4SCHLUMBERGER TECHNOLOGY CORP3
Top patents by PatentIndex Score
54 records- 0196US8529026B2Droplet generatorCLARKE ANDREW·Filed 2010·Granted Sep 10, 2013·26 cites·38 claims
- 0294US8697008B2Droplet generatorCLARKE ANDREW·Filed 2010·Granted Apr 15, 2014·10 cites·20 claims
- 0393US11410937B2Semiconductor device with aluminum nitride anti-deflection layerRAYTHEON CO·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0493US6562141B2Dual degas/cool loadlock cluster toolFiled 2001·Granted May 13, 2003·62 cites·10 claims
- 0593US6099913AMethod for curtain coating at high speedsEASTMAN KODAK CO·Filed 1998·Granted Aug 8, 2000·35 cites·6 claims
- 0692US8263683B2Ink for printing on low energy substratesGIBSON DANUTA·Filed 2007·Granted Sep 11, 2012·39 cites·17 claims
- 0791US6103313AMethod for electrostatically assisted curtain coating at high speedsEASTMAN KODAK CO·Filed 1998·Granted Aug 15, 2000·23 cites·9 claims
- 0890US5438823AHeat exchange apparatus for gas turbine fluidsROLLS ROYCE PLC·Filed 1991·Granted Aug 8, 1995·106 cites·11 claims
- 0988US10515905B1Semiconductor device with anti-deflection layersRAYTHEON CO·Filed 2018·Granted Dec 24, 2019·5 cites·21 claims
- 1088US6235656B1Dual degas/cool loadlock cluster toolFiled 2000·Granted May 22, 2001·41 cites·5 claims
- 1184US8398226B2Inkjet printing systemHIGGINS JOHN M·Filed 2009·Granted Mar 19, 2013·6 cites·20 claims
- 1283US6780455B2Method of creating and coating a materialEASTMAN KODAK CO·Filed 2002·Granted Aug 24, 2004·9 cites·18 claims
- 1380US8439487B2Continuous ink jet printing of encapsulated dropletsCLARKE ANDREW·Filed 2008·Granted May 14, 2013·10 cites·14 claims
- 1480US8302880B2Monodisperse droplet generationCLARKE ANDREW·Filed 2008·Granted Nov 6, 2012·10 cites·18 claims
- 1579US7232214B2Method for increasing the diameter of an ink jet ink dotEASTMAN KODAK CO·Filed 2004·Granted Jun 19, 2007·10 cites·11 claims
- 1678US5135634AApparatus for depositing a thin layer of sputtered atoms on a memberSPUTTERED FILMS INC·Filed 1991·Granted Aug 4, 1992·32 cites·20 claims
- 1777US6945647B2Method for increasing the diameter of an ink jet ink dotEASTMAN KODAK CO·Filed 2002·Granted Sep 20, 2005·9 cites·12 claims
- 1873US12354911B2Cu3Sn via metallization in electrical devices for low-temperature 3D-integrationRAYTHEON CO·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1972US6921562B2Ink jet recording elementEASTMAN KODAK CO·Filed 2002·Granted Jul 26, 2005·7 cites·12 claims
- 2068US2025198711A1Equipment and method using elastic turbulenceSCHLUMBERGER TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2167US2025096288A1Flowing electrochemical cellsSCHLUMBERGER TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2265US8186784B2Continuous inkjet printingCLARKE ANDREW·Filed 2008·Granted May 29, 2012·4 cites·20 claims
- 2364US8154485B2Display elementCLARKE ANDREW·Filed 2005·Granted Apr 10, 2012·3 cites·10 claims
- 2463US11851785B2Aluminum nitride passivation layer for mercury cadmium telluride in an electrical deviceRAYTHEON CO·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2562US6572516B2Device to reduce electrostatic pattern transfer in coating processesEASTMAN KODAK CO·Filed 2002·Granted Jun 3, 2003·10 cites·8 claims
- 2660US11817521B2Electrical contact fabricationRAYTHEON CO·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 2760US9010911B2Continuous inkjet drop generation deviceCLARKE ANDREW·Filed 2008·Granted Apr 21, 2015·1 cites·20 claims
- 2859US11854879B2Cu3Sn via metallization in electrical devices for low-temperature 3D-integrationRAYTHEON CO·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2958US7436576B2Display elementEASTMAN KODAK CO·Filed 2005·Granted Oct 14, 2008·3 cites·19 claims
- 3056US6830664B2Cluster tool with a hollow cathode arrayTEGAL CORP·Filed 2002·Granted Dec 14, 2004·2 cites·21 claims
- 3156US2025093110A1Heat Transfer SystemSCHLUMBERGER TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 3255US2012046407A1Method of preparing stimulus-responsive polymeric particlesCLARKE ANDREW·Filed 2009·Application pending·0 cites
- 3353US11659660B2Oxide liner stress bufferRAYTHEON CO·Filed 2019·Granted May 23, 2023·0 cites·20 claims
- 3453US6584777B1Apparatus for and method of filtering a fluidROLLS ROYCE PLC·Filed 2000·Granted Jul 1, 2003·14 cites·26 claims
- 3552US5766426AApparatus for, and method of, depositing a film on a substrateSPUTTERED FILMS INC·Filed 1995·Granted Jun 16, 1998·10 cites·35 claims
- 3651US11894477B2Electrical device with stress buffer layer and stress compensation layerRAYTHEON CO·Filed 2021·Granted Feb 6, 2024·0 cites·10 claims
- 3749US6086947AMethod of depositing materials on a wafer to eliminate the effect of cracks in the depositionSPUTTERED FILMS INC·Filed 1996·Granted Jul 11, 2000·11 cites·26 claims
- 3848US12002773B2Hybrid pocket post and tailored via dielectric for 3D-integrated electrical deviceRAYTHEON CO·Filed 2021·Granted Jun 4, 2024·0 cites·15 claims
- 3948US2016074697A1A tug-of war apparatusROCK FORGING·Filed 2014·Application pending·0 cites
- 4047US8663389B2Method and apparatus for crystal growth using a membrane-assisted semi-closed reactorCLARKE ANDREW PETER·Filed 2011·Granted Mar 4, 2014·0 cites·11 claims
- 4146US5609923AMethod of curtain coating a moving support wherein the maximum practical coating speed is increasedEASTMAN KODAK CO·Filed 1996·Granted Mar 11, 1997·9 cites·10 claims
- 4245US2022416095A1Low-stress dielectric layer, planarization method, and low-temperature processing for 3d-integrated electrical deviceRAYTHEON CO·Filed 2021·Application pending·0 cites
- 4343US2011245400A1Stimulus-responsive polymeric particlesWEAR TREVOR JOHN·Filed 2011·Application pending·0 cites
- 4443US2011159250A1Patterning methodEASTMAN KODAK CO·Filed 2008·Application pending·0 cites
- 4542US8272716B2Method of continuous inkjet printingCLARKE ANDREW·Filed 2008·Granted Sep 25, 2012·0 cites·18 claims
- 4642US2007286943A1Method of Forming Uniform Lines on a SubstrateCLARKE ANDREW·Filed 2005·Application pending·0 cites
- 4741US2003066606A1Dual wafer position loadlock chamberFiled 2002·Application pending·0 cites
- 4840US6605198B1Apparatus for, and method of, depositing a film on a substrateSPUTTERED FILMS INC·Filed 1995·Granted Aug 12, 2003·8 cites·63 claims
- 4940US2010301337A1Electronic device with self-aligned electrodes fabricated using additive liquid depositionRIDER CHRISTOPHER B·Filed 2008·Application pending·0 cites
- 5039US11101130B2Method of filling grooves and holes in a substrateRAYTHEON CO·Filed 2019·Granted Aug 24, 2021·0 cites·25 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →