Inventor · disambiguated record
Ankur H. Desai
Also filed as: DESAI ANKUR · DESAI ANKUR H
5 granted patents·233 citations·filing 1994–2000
85Inventor score
Top patents by PatentIndex Score
5 records- 0188US5422316ASemiconductor wafer polisher and methodMEMC ELECTRONIC MATERIALS·Filed 1994·Granted Jun 6, 1995·72 cites·22 claims
- 0284US6294469B1Silicon wafering process flowPLASMASIL LLC·Filed 2000·Granted Sep 25, 2001·59 cites·13 claims
- 0374US6030887AFlattening process for epitaxial semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1998·Granted Feb 29, 2000·51 cites·46 claims
- 0467US6200908B1Process for reducing waviness in semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Mar 13, 2001·38 cites·22 claims
- 0541US5787595AMethod and apparatus for controlling flatness of polished semiconductor waferMEMC ELECTRIC MATERIALS INC·Filed 1996·Granted Aug 4, 1998·13 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →