Inventor · disambiguated record

Angel Enverga

Also filed as: ENVERGA ANGEL

3 granted patents·4 citations·filing 2021–2024

56Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0187US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
0281US11908771B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·1 cites·23 claims
0371US12334414B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →