Inventor · disambiguated record
Anand Govind
Also filed as: GOVIND ANAND
12 granted patents·204 citations·filing 2001–2005
92Inventor score
Files withLSI LOGIC CORP12
Top patents by PatentIndex Score
12 records- 0193US6701270B1Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the sourceLSI LOGIC CORP·Filed 2001·Granted Mar 2, 2004·67 cites·20 claims
- 0286US7081672B1Substrate via layout to improve bias humidity testing reliabilityLSI LOGIC CORP·Filed 2005·Granted Jul 25, 2006·15 cites·19 claims
- 0386US6531932B1Microstrip package having optimized signal line impedance controlLSI LOGIC CORP·Filed 2001·Granted Mar 11, 2003·23 cites·10 claims
- 0481US6496081B1Transmission equalization system and an integrated circuit package employing the sameLSI LOGIC CORP·Filed 2001·Granted Dec 17, 2002·23 cites·21 claims
- 0579US7095107B2Ball assignment schemes for integrated circuit packagesLSI LOGIC CORP·Filed 2004·Granted Aug 22, 2006·26 cites·20 claims
- 0667US6700207B2Flip-chip ball grid array package for electromigration testingLSI LOGIC CORP·Filed 2002·Granted Mar 2, 2004·18 cites·14 claims
- 0766US6759921B1Characteristic impedance equalizer and an integrated circuit package employing the sameLSI LOGIC CORP·Filed 2001·Granted Jul 6, 2004·13 cites·18 claims
- 0856US6946866B2Measurement of package interconnect impedance using tester and supporting testerLSI LOGIC CORP·Filed 2003·Granted Sep 20, 2005·7 cites·13 claims
- 0952US7105926B2Routing scheme for differential pairs in flip chip substratesLSI LOGIC CORP·Filed 2003·Granted Sep 12, 2006·5 cites·32 claims
- 1048US7345245B2Robust high density substrate design for thermal cycling reliabilityLSI LOGIC CORP·Filed 2003·Granted Mar 18, 2008·3 cites·12 claims
- 1143US6825066B2Stiffener designLSI LOGIC CORP·Filed 2002·Granted Nov 30, 2004·1 cites·20 claims
- 1242US6534968B1Integrated circuit test vehicleLSI LOGIC CORP·Filed 2001·Granted Mar 18, 2003·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →