Inventor · disambiguated record
Andrey Gunawan
Also filed as: GUNAWAN ANDREY
0 granted patents·6 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0156US2025201720A1Methods, systems, apparatus, and articles of manufacture to reduce intermetallic compound formation in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2025112161A1Methods and apparatus to connect interconnect bridges to package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0353US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0452US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0551US2024186280A1Thermocompression bonding tool for panel-level thermo-compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 0648US2024186281A1Method for panel-level thermo-compression bondingINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →