Inventor · disambiguated record
Andy E. Hooper
Also filed as: HOOPER ANDY · HOOPER ANDY E
12 granted patents·2 pending applications·62 citations·filing 2002–2022
89Inventor score
Files withMICRON TECHNOLOGY INC6FREESCALE SEMICONDUCTOR INC3HOOPER ANDY2BRULAND KELLY1ELECTRO SCIENT IND INC1
Top patents by PatentIndex Score
14 records- 0193US9070656B2Underfill-accommodating heat spreaders and related semiconductor device assemblies and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 30, 2015·21 cites·20 claims
- 0286US7432024B2Lithographic template and method of formation and useFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 7, 2008·6 cites·20 claims
- 0384US10340173B2System for handling semiconductor diesMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 2, 2019·3 cites·11 claims
- 0484US10079169B1Backside stealth dicing through tape followed by front side laser ablation dicing processMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 18, 2018·5 cites·7 claims
- 0579US8894868B2Substrate containing aperture and methods of forming the sameHOOPER ANDY·Filed 2011·Granted Nov 25, 2014·7 cites·33 claims
- 0675US11562922B2Semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 24, 2023·0 cites·20 claims
- 0772US7977213B1Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpieceELECTRO SCIENT IND INC·Filed 2010·Granted Jul 12, 2011·3 cites·8 claims
- 0868US7083880B2Lithographic template and method of formation and useFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 1, 2006·7 cites·30 claims
- 0964US11232970B2Semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 25, 2022·0 cites·14 claims
- 1064US7132372B2Method for preparing a semiconductor substrate surface for semiconductor device fabricationFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Nov 7, 2006·10 cites·24 claims
- 1152US10373857B2Backside stealth dicing through tape followed by front side laser ablation dicing processMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 6, 2019·0 cites·3 claims
- 1235US2012133381A1Stackable semiconductor chip with edge features and methods of fabricating and processing sameBRULAND KELLY·Filed 2010·Application pending·0 cites
- 1334US2012168412A1Apparatus and method for forming an aperture in a substrateHOOPER ANDY·Filed 2012·Application pending·0 cites
- 1431US8178906B2Laser chalcogenide phase change deviceHOOPER ANDY E·Filed 2008·Granted May 15, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →