Inventor · disambiguated record
Andrew Arthur Ketterson
Also filed as: KETTERSON ANDREW · KETTERSON ANDREW A · KETTERSON ANDREW ARTHUR
17 granted patents·3 pending applications·127 citations·filing 1986–2025
91Inventor score
Files withQORVO US INC15SAUNIER PAUL1SCHUETTE MICHAEL1TRI QUINT SEMICONDUCTOR INC1TRIQUINT SEMICONDUCTOR INC1
Top patents by PatentIndex Score
20 records- 0194US11626340B2Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)QORVO US INC·Filed 2019·Granted Apr 11, 2023·9 cites·22 claims
- 0294US11557545B2Monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shieldingQORVO US INC·Filed 2019·Granted Jan 17, 2023·12 cites·18 claims
- 0391US10601398B2BAW structure having multiple BAW transducers over a common reflector, which has reflector layers of varying thicknessesQORVO US INC·Filed 2018·Granted Mar 24, 2020·8 cites·24 claims
- 0490US4827320ASemiconductor device with strained InGaAs layerUNIV ILLINOIS·Filed 1986·Granted May 2, 1989·74 cites·20 claims
- 0585US10553782B2Passive magnetic devicesQORVO US INC·Filed 2018·Granted Feb 4, 2020·2 cites·13 claims
- 0678US10832984B2Environmental protection for wafer level and package level applicationsQORVO US INC·Filed 2020·Granted Nov 10, 2020·1 cites·8 claims
- 0778US9472633B1Transistor gate having an insulating layer support structureSCHUETTE MICHAEL·Filed 2011·Granted Oct 18, 2016·7 cites·25 claims
- 0874US11929300B2Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)QORVO US INC·Filed 2023·Granted Mar 12, 2024·0 cites·18 claims
- 0974US11908808B2Monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shieldingQORVO US INC·Filed 2023·Granted Feb 20, 2024·0 cites·20 claims
- 1072US7130124B2Average pitch gratings for optical filtering applicationsTRI QUINT SEMICONDUCTOR INC·Filed 2003·Granted Oct 31, 2006·11 cites·26 claims
- 1170US10651103B2Environmental protection for wafer level and package level applicationsQORVO US INC·Filed 2017·Granted May 12, 2020·1 cites·19 claims
- 1268US11152677B2Integration of self-biased magnetic circulators with microwave devicesQORVO US INC·Filed 2019·Granted Oct 19, 2021·1 cites·20 claims
- 1366US2025385423A1Antenna packageQORVO US INC·Filed 2025·Application pending·0 cites
- 1465US10854810B2Passive magnetic devicesQORVO US INC·Filed 2020·Granted Dec 1, 2020·0 cites·15 claims
- 1559US11699629B2Integrated circuit die stacked with backer die including capacitors and thermal viasQORVO US INC·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 1653US11251292B2High electron mobility transistorQORVO US INC·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1748US2025259945A1Sacrificial plate insert for rigid-core laminate tooling-hole drillingQORVO US INC·Filed 2025·Application pending·0 cites
- 1845US11791312B2MMICs with backside interconnects for fanout-style packagingQORVO US INC·Filed 2019·Granted Oct 17, 2023·0 cites·14 claims
- 1937US7148463B2Increased responsivity photodetectorTRIQUINT SEMICONDUCTOR INC·Filed 2003·Granted Dec 12, 2006·1 cites·30 claims
- 2035US2013320349A1In-situ barrier oxidation techniques and configurationsSAUNIER PAUL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →