Inventor · disambiguated record
Ande Kitamura
Also filed as: KITAMURA Ande
1 granted patent·11 pending applications·1 citations·filing 2018–2023
16Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0168US11444205B2Contact stacks to reduce hydrogen in thin film transistorINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·23 claims
- 0253US2025113521A1Direct transfer of transition metal dichalcogenide monolayers using diffusion bonding layersINTEL CORP·Filed 2023·Application pending·0 cites
- 0352US2024222461A1Beol contact metals for 2d transistorsINTEL CORP·Filed 2022·Application pending·0 cites
- 0452US2024222483A12d nanoribbons utilizing silicon scaffoldingINTEL CORP·Filed 2022·Application pending·0 cites
- 0551US2024222484A1Transistor with channel material in a stack with insulator material supportsINTEL CORP·Filed 2022·Application pending·0 cites
- 0651US2024222482A1Transistor structures having a doping layer on transition metal dichalcogenide layers outside of the channel regionINTEL CORP·Filed 2022·Application pending·0 cites
- 0751US2024222113A1Passivation of crystalline substrate for metal chalcogen material synthesisINTEL CORP·Filed 2022·Application pending·0 cites
- 0850US2024222428A1Seeded growth for 2d nanoribbon transistorsINTEL CORP·Filed 2022·Application pending·0 cites
- 0950US2024222485A1Transfer-free 2d fet and fefet device fabrication by 2d material growth in superlattice with nitridesINTEL CORP·Filed 2022·Application pending·0 cites
- 1050US2023420364A1Microelectronic die with two dimensional (2d) complementary metal oxide semiconductor devices in an interconnect stack thereofINTEL CORP·Filed 2022·Application pending·0 cites
- 1149US2024006481A1Alternating sacrificial layer materials for mechanically stable 2d nanoribbon etchINTEL CORP·Filed 2022·Application pending·0 cites
- 1249US2023411390A1Two-dimensional pmos devices for providing cmos in back-end layers of integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →