Inventor · disambiguated record
Anton Kolbeck
Also filed as: KOLBECK ANTON
5 granted patents·25 citations·filing 2005–2011
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0186US7772036B2Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 10, 2010·16 cites·9 claims
- 0268US8004069B2Lead frame based semiconductor package and a method of manufacturing the sameFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 23, 2011·4 cites·20 claims
- 0366US8659146B2Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturingBAUER ROBERT·Filed 2010·Granted Feb 25, 2014·2 cites·19 claims
- 0463US8456023B2Semiconductor wafer processingBAUER ROBERT·Filed 2007·Granted Jun 4, 2013·3 cites·20 claims
- 0546US8283762B2Lead frame based semiconductor package and a method of manufacturing the sameBAUER ROBERT·Filed 2011·Granted Oct 9, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →