Inventor · disambiguated record
Andrew Christopher Laib
Also filed as: LAIB ANDREW · LAIB ANDREW CHRISTOPHER
2 granted patents·5 pending applications·0 citations·filing 2016–2025
25Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0159US12274006B2Printed circuit board with mold adhesion boundary for die attach padSKYWORKS SOLUTIONS INC·Filed 2023·Granted Apr 8, 2025·0 cites·24 claims
- 0259US2025246574A1Electronics package with substrate recess and circuitry components interconnected over the substrate recessSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 0359US2025246581A1Electronics package with substrate recess and circuitry components overhanging the substrate recessSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 0458US2024347474A1Metal clip in integrated device package for grounding and electromagnetic shieldingSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0558US2024347475A1Integrated device package with metal clip for stacking electronic componentsSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0655US2025294684A1Printed circuit board with mold adhesion boundary for die attach padSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 0731US9449938B2Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereofHenkel IP & Holding GmbH·Filed 2016·Granted Sep 20, 2016·0 cites·45 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →