Inventor · disambiguated record
Andrew Kw Leung
Also filed as: LEUNG ANDREW · LEUNG ANDREW K · LEUNG ANDREW K W · LEUNG ANDREW KW
7 granted patents·6 pending applications·25 citations·filing 2002–2014
81Inventor score
Files withLEUNG ANDREW K W3LEUNG ANDREW KW3ADVANCED MICRO DEVICES INC1ATI TECHNOLOGIES ULC1LEUNG ANDREW1
Top patents by PatentIndex Score
13 records- 0186US8298945B2Method of manufacturing substrates having asymmetric buildup layersLEUNG ANDREW·Filed 2011·Granted Oct 30, 2012·9 cites·14 claims
- 0274US8445329B2Circuit board with oval micro viaLEUNG ANDREW K W·Filed 2009·Granted May 21, 2013·7 cites·19 claims
- 0366US7906424B2Conductor bump method and apparatusADVANCED MICRO DEVICES INC·Filed 2007·Granted Mar 15, 2011·3 cites·18 claims
- 0465US9793199B2Circuit board with via trace connection and method of making the sameLEUNG ANDREW K W·Filed 2009·Granted Oct 17, 2017·3 cites·16 claims
- 0562US10431533B2Circuit board with constrained solder interconnect padsTOPACIO RODEN·Filed 2014·Granted Oct 1, 2019·1 cites·20 claims
- 0661US8772083B2Solder mask with anchor structuresLEUNG ANDREW K W·Filed 2011·Granted Jul 8, 2014·2 cites·12 claims
- 0750US2011024898A1Method of manufacturing substrates having asymmetric buildup layersATI TECHNOLOGIES ULC·Filed 2009·Application pending·0 cites
- 0847US8294266B2Conductor bump method and apparatusTOPACIO RODEN R·Filed 2011·Granted Oct 23, 2012·0 cites·15 claims
- 0945US2012120615A1Circuit board with via trace connection and method of making the sameLEUNG ANDREW KW·Filed 2012·Application pending·0 cites
- 1043US2011110061A1Circuit Board with Offset ViaLEUNG ANDREW KW·Filed 2009·Application pending·0 cites
- 1142US2016073493A1Stiffener ring for circuit boardLEUNG ANDREW KW·Filed 2014·Application pending·0 cites
- 1236US2002186954A1Fiber optic array assembly and method of making the sameSCHOTT OPTOVANCE INC·Filed 2002·Application pending·0 cites
- 1336US2012175772A1Alternative surface finishes for flip-chip ball grid arraysLEUNG ANDREW K·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →